关键词: 电沉积, 铜, 旋转电极, 微沟道, 芯片, 超等厚沉积

Abstract: Silicon chips patterned with treneches were fixed onto a rotating electrode. Copper was electrodeposited into the trenches under rotating hydrodynamic conditions The sizes of the trenches are 1 m in height and 0.35 m, 0.50 m and 0.70 m in width, respectively. The effects of rotating of the chip, the current density and the concentration of Cu~(2+ )on the filling of thetrenches were studied. It is found that lower current density and moderate concentration of Cu~(2+)resulted in a void free filling of the trenches.

Key words: Electrodeposition, Copper, Rotating electrode, Trench, Chip, Super-conformal plating