PCB酸性蚀刻液中缓蚀剂对厚铜线路制作的影响

doi:10.13208/j.electrochem.2213007

电化学（中英文） ›› 2022, Vol. 28 ›› Issue (7): 2213007. doi: 10.13208/j.electrochem.2213007

所属专题： “电子电镀和腐蚀”专题文章

PCB酸性蚀刻液中缓蚀剂对厚铜线路制作的影响

王小丽¹, 何为¹, 陈先明², 曾红³, 苏元章¹, 王翀¹, 李高升¹, 黄本霞², 冯磊², 黄高², 陈苑明¹^,^*()

1.电子科技大学材料与能源学院,四川成都 611731
2.珠海越亚半导体股份有限公司,广东珠海 519175
3.广州广合科技股份有限公司, 广东广州 510735

收稿日期:2022-03-04 修回日期:2022-04-14 出版日期:2022-07-28 发布日期:2022-05-17
通讯作者: 陈苑明 E-mail:ymchen@uestc.edu.cn

Effect of Corrosion Inhibitors on Copper Etching to Form Thick Copper Line of PCB in Acidic Etching Solution

Xiao-Li Wang¹, Wei He¹, Xian-Ming Chen², Hong Zeng³, Yuan-Zhang Su¹, Chong Wang¹, Gao-Sheng Li¹, Ben-Xia Huang², Lei Feng², Gao Huang², Yuan-Ming Chen¹^,^*()

1. School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 611731, Sichuan, China
2. Zhuhai ACCESS Semiconductor Co., Ltd, Zhuhai 519175, Guangdong, China
3. Delton Technology (Guangzhou) Co., Ltd, Guangzhou 510735, Guangdong, China

Received:2022-03-04 Revised:2022-04-14 Published:2022-07-28 Online:2022-05-17
Contact: Yuan-Ming Chen E-mail:ymchen@uestc.edu.cn

摘要/Abstract

摘要：

以2-巯基苯并噻唑(2-MBT)、苯并三氮唑(BTA)和苯氧基乙醇(MSDS)作为缓蚀剂, 研究了其加入在酸性蚀刻液后对PCB厚铜线路的缓蚀效果。通过接触角测试、电化学测试和蚀刻因子得出缓蚀状态,并结合扫描电子显微镜观察铜表面形貌。通过分子动力学计算和量子化学模拟分析缓蚀剂在铜表面的吸附机理。结果表明,2-MBT + MSDS与BTA + MSDS的分子结构可有效地平行吸附在铜表面,且吸附能高于单一缓蚀剂。加入了2-MBT + MSDS的蚀刻液,对厚度约为33 μm铜线路进行刻蚀,铜线路的蚀刻因子提高到6.59,可有效应用于PCB厚铜线路制作。

关键词: 缓蚀剂, 协同作用, 厚铜线路, 酸性蚀刻液

Abstract:

The chemical compounds of 2-mercaptobenzothiazole (2-MBT), benzotriazole (BTA) and phenoxyethanol (MSDS) as corrosion inhibitors were used to inhibit the copper etching to form the thick copper line of PCB in the acidic etching solution. The inhibition status was characterized with contact angle measurement, electrochemical test and etch factor calculation, while the corrosion morphology of copper surface was studied by scanning electron microscope. The adsorption mechanism of corrosion inhibitors on copper surface is analyzed by molecular dynamics and quantum chemistry calculations. The results indicated that the synergistic function of the two inhibitors could effectively promote their adsorption on the copper surface in parallel, while their adsorption energy could be higher than that of the single inhibitor. The etch factor of the thick copper line with about 33 μm in thickness increased to 6.59 from the etching solution with 2-MBT and MSDS for good agreement of PCB manufacture.

Key words: corrosion inhibitor, synergistic function, thick copper line, acidic etching solution

王小丽, 何为, 陈先明, 曾红, 苏元章, 王翀, 李高升, 黄本霞, 冯磊, 黄高, 陈苑明. PCB酸性蚀刻液中缓蚀剂对厚铜线路制作的影响[J]. 电化学（中英文）, 2022, 28(7): 2213007.

Xiao-Li Wang, Wei He, Xian-Ming Chen, Hong Zeng, Yuan-Zhang Su, Chong Wang, Gao-Sheng Li, Ben-Xia Huang, Lei Feng, Gao Huang, Yuan-Ming Chen. Effect of Corrosion Inhibitors on Copper Etching to Form Thick Copper Line of PCB in Acidic Etching Solution[J]. Journal of Electrochemistry, 2022, 28(7): 2213007.

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链接本文: https://electrochem.xmu.edu.cn/CN/10.13208/j.electrochem.2213007

https://electrochem.xmu.edu.cn/CN/Y2022/V28/I7/2213007

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PCB酸性蚀刻液中缓蚀剂对厚铜线路制作的影响

Effect of Corrosion Inhibitors on Copper Etching to Form Thick Copper Line of PCB in Acidic Etching Solution

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