PCB酸性蚀刻液中缓蚀剂对厚铜线路制作的影响

doi:10.13208/j.electrochem.2213007

电化学（中英文） ›› 2022, Vol. 28 ›› Issue (7): 2213007. doi: 10.13208/j.electrochem.2213007

所属专题： “电子电镀和腐蚀”专题文章

PCB酸性蚀刻液中缓蚀剂对厚铜线路制作的影响

王小丽¹, 何为¹, 陈先明², 曾红³, 苏元章¹, 王翀¹, 李高升¹, 黄本霞², 冯磊², 黄高², 陈苑明¹^,^*()

1.电子科技大学材料与能源学院,四川成都 611731
2.珠海越亚半导体股份有限公司,广东珠海 519175
3.广州广合科技股份有限公司, 广东广州 510735

收稿日期:2022-03-04 修回日期:2022-04-14 出版日期:2022-07-28 发布日期:2022-05-17

Effect of Corrosion Inhibitors on Copper Etching to Form Thick Copper Line of PCB in Acidic Etching Solution

Xiao-Li Wang¹, Wei He¹, Xian-Ming Chen², Hong Zeng³, Yuan-Zhang Su¹, Chong Wang¹, Gao-Sheng Li¹, Ben-Xia Huang², Lei Feng², Gao Huang², Yuan-Ming Chen¹^,^*()

1. School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 611731, Sichuan, China
2. Zhuhai ACCESS Semiconductor Co., Ltd, Zhuhai 519175, Guangdong, China
3. Delton Technology (Guangzhou) Co., Ltd, Guangzhou 510735, Guangdong, China

Received:2022-03-04 Revised:2022-04-14 Published:2022-07-28 Online:2022-05-17
Contact: * Tel: (86)18980602785 E-mail: ymchen@uestc.edu.cn

摘要/Abstract

摘要：

以2-巯基苯并噻唑(2-MBT)、苯并三氮唑(BTA)和苯氧基乙醇(MSDS)作为缓蚀剂, 研究了其加入在酸性蚀刻液后对PCB厚铜线路的缓蚀效果。通过接触角测试、电化学测试和蚀刻因子得出缓蚀状态,并结合扫描电子显微镜观察铜表面形貌。通过分子动力学计算和量子化学模拟分析缓蚀剂在铜表面的吸附机理。结果表明,2-MBT + MSDS与BTA + MSDS的分子结构可有效地平行吸附在铜表面,且吸附能高于单一缓蚀剂。加入了2-MBT + MSDS的蚀刻液,对厚度约为33 μm铜线路进行刻蚀,铜线路的蚀刻因子提高到6.59,可有效应用于PCB厚铜线路制作。

关键词: 缓蚀剂, 协同作用, 厚铜线路, 酸性蚀刻液

Abstract:

The chemical compounds of 2-mercaptobenzothiazole (2-MBT), benzotriazole (BTA) and phenoxyethanol (MSDS) as corrosion inhibitors were used to inhibit the copper etching to form the thick copper line of PCB in the acidic etching solution. The inhibition status was characterized with contact angle measurement, electrochemical test and etch factor calculation, while the corrosion morphology of copper surface was studied by scanning electron microscope. The adsorption mechanism of corrosion inhibitors on copper surface is analyzed by molecular dynamics and quantum chemistry calculations. The results indicated that the synergistic function of the two inhibitors could effectively promote their adsorption on the copper surface in parallel, while their adsorption energy could be higher than that of the single inhibitor. The etch factor of the thick copper line with about 33 μm in thickness increased to 6.59 from the etching solution with 2-MBT and MSDS for good agreement of PCB manufacture.

Key words: corrosion inhibitor, synergistic function, thick copper line, acidic etching solution

王小丽, 何为, 陈先明, 曾红, 苏元章, 王翀, 李高升, 黄本霞, 冯磊, 黄高, 陈苑明. PCB酸性蚀刻液中缓蚀剂对厚铜线路制作的影响[J]. 电化学（中英文）, 2022, 28(7): 2213007.

Xiao-Li Wang, Wei He, Xian-Ming Chen, Hong Zeng, Yuan-Zhang Su, Chong Wang, Gao-Sheng Li, Ben-Xia Huang, Lei Feng, Gao Huang, Yuan-Ming Chen. Effect of Corrosion Inhibitors on Copper Etching to Form Thick Copper Line of PCB in Acidic Etching Solution[J]. Journal of Electrochemistry, 2022, 28(7): 2213007.

导出引用管理器 EndNote|Ris|BibTeX

链接本文: https://electrochem.xmu.edu.cn/CN/10.13208/j.electrochem.2213007

https://electrochem.xmu.edu.cn/CN/Y2022/V28/I7/2213007

图/表 9

参考文献 22

[1]	He W. Electrical information science and technology[M]. Beijing: China Machine Press, 2021. 1-11.
[2]	Huang H L, Guo X P, Zhang G A, Dong Z H. Effect of direct current electric field on atmospheric corrosion behavior of copper under thin electrolyte layer[J]. Corrosion Sci., 2011, 53(10): 3446-3449. doi: 10.1016/j.corsci.2011.04.017 URL
[3]	Zhang S T, Tao Z H, Li W H, Hou B R. The effect of some triazole derivatives as inhibitors for the corrosion of mild steel in 1 M hydrochloric acid[J]. Appl. Surf. Sci., 2009, 255(15): 6757-6763. doi: 10.1016/j.apsusc.2008.09.089 URL
[4]	Papapanayiotou D, Deligianni H, Alkire R C. Effect of Benzotriazole on the anisotropic electrolytic etching of copper[J]. J. Electrochem. Soc., 1998, 145(9): 3016-3024. doi: 10.1149/1.1838757 URL
[5]	Cakir O. Copper etching with cupric chloride and regeneration of waste etchant[J]. J. Mater. Process. Technol., 2006, 175(1-3): 63-68. doi: 10.1016/j.jmatprotec.2005.04.024 URL
[6]	Chen Y M, He W, Chen X M, Wang C, Tao Z H, Wang S X, Zhou G Y, Moshrefi-Torbati M. Plating uniformity of bottom-up copper pillars and patterns for IC substrates with additive-assisted electrodeposition[J]. Electrochim. Acta, 2014, 120: 293-301. doi: 10.1016/j.electacta.2013.12.112 URL
[7]	Zhong Y Q, Zhang W F, Jin L K, Sun B H. Improvement of fine line manufacturing by etching addictive[J]. Printed Circuit Information, 2018, 15(2):56-62.
[8]	Guo X M, Huang H L, Liu D. The inhibition mechanism and adsorption behavior of three purine derivatives on the corrosion of copper in alkaline artificial seawater: structure and performance[J]. Colloid Surf. A-Physicochem. Eng. Asp., 2021, 622: 126644. doi: 10.1016/j.colsurfa.2021.126644 URL
[9]	Li L, Zhang X H, Gong S D, Zhao H X, Bai Y, Li Q S, Ji L. The discussion of descriptors for the QSAR model and molecular dynamics simulation of benzimidazole derivatives as corrosion inhibitors[J]. Corrosion Sci., 2015, 99: 76-88. doi: 10.1016/j.corsci.2015.06.003 URL
[10]	Sherif E S M, Erasmus R M, Comins J D. Inhibition of copper corrosion in acidic chloride pickling solutions by 5-(3-aminophenyl)-tetrazole as a corrosion inhibitor[J]. Corrosion Sci., 2008, 50(12): 3439-3445. doi: 10.1016/j.corsci.2008.10.002 URL
[11]	Lei S S, Wang S L, Li H L, Wang C W, Yang Y D A, Cheng Y S, Li S. Effect of benzotriazole and 5-methyl/ 1-H carboxyl benzotriazole on chemical mechanical polishing of cobalt in H₂O₂ based slurry[J]. ECS J. Solid State Sci. Technol., 2021, 10(7): 074002. doi: 10.1149/2162-8777/ac0e0e URL
[12]	Moretti G, Guidi F, Grion G. Tryptamine as a green iron corrosion inhibitor in 0.5 M deaerated sulphuric acid[J]. Corrosion Sci., 2004, 46(2): 387-403. doi: 10.1016/S0010-938X(03)00150-1 URL
[13]	Huang H L, Guo X M. The Relationship between the inhibition performances of three benzo derivatives and their structures on the corrosion of copper in 3.5wt.% NaCl solution[J]. Colloid Surf. A-Physicochem. Eng. Asp., 2020, 598: 124809. doi: 10.1016/j.colsurfa.2020.124809 URL
[14]	Chiter F, Costa D, Maurice V, Marcus P. DFT investigation of 2-mercaptobenzothiazole adsorption on model oxidized copper surfaces and relationship with corrosion inhibition[J]. Appl. Surf. Sci., 2020, 537: 147802. doi: 10.1016/j.apsusc.2020.147802 URL
[15]	Li G S. Investigation on etching technology and corrosion inhibition mechanism of thick copper circuit[D]. Chengdu: University of Electronic Science and Technology of China, 2020.
[16]	Guo L, Dong W P, Zhang S T. Theoretical challenges in understanding the inhibition mechanism of copper corrosion in acid media in the presence of three triazole derivatives[J]. RSC Adv., 2014, 4(79): 41956-41967. doi: 10.1039/C4RA04931D URL
[17]	Gece G, Bilgi S, Türken. Quantum chemical studies of some amino acids on the corrosion of cobalt in sulfuric acid solution[J]. Mater. Corros., 2010, 61(2): 141-146.
[18]	Awad M K, Mustafa M R, Elnga M M A. Computational simulation of the molecular structure of some triazoles as inhibitors for the corrosion of metal surface[J]. Theochem-J. Mol. Struct., 2010, 959(1-3): 66-74. doi: 10.1016/j.theochem.2010.08.008 URL
[19]	Chen J, Qiang Y J, Peng S N, Gong Z L, Zhang S T, Gao L Z, Tan B C, Chen S J, Guo L. Experimental and computational investigations of 2-amino-6-bromobenzothiazole as a corrosion inhibitor for copper in sulfuric acid[J]. J. Adhes. Sci. Technol., 2018, 32(19): 2083-2098. doi: 10.1080/01694243.2018.1460948 URL
[20]	Bastidas J M, Pinilla P, Cano E, Polo J L, Miguel S. Copper corrosion inhibition by triphenylmethane derivatives in sulphuric acid media[J]. Corrosion Sci., 2003, 45(2): 427-449. doi: 10.1016/S0010-938X(02)00123-3 URL
[21]	Tao Z H, He W, Wang S X, Zhou G Y. Electrochemical study of cyproconazole as a novel corrosion inhibitor for copper in acidic solution[J]. Ind. Eng. Chem. Res., 2013, 52(50): 17891-17899. doi: 10.1021/ie402693d URL
[22]	Aboelnga M M, Awad M K, Gauld J W, Mustafa M R. An assessment to evaluate the validity of different methods for the description of some corrosion inhibitors[J]. J. Mol. Model., 2014, 20(9): 2422. doi: 10.1007/s00894-014-2422-2 pmid: 25164372

PCB酸性蚀刻液中缓蚀剂对厚铜线路制作的影响

Effect of Corrosion Inhibitors on Copper Etching to Form Thick Copper Line of PCB in Acidic Etching Solution

RichHTML

PDF (PC)

可视化

摘要/Abstract

引用本文

使用本文

图/表 9

参考文献 22

相关文章 15

Metrics

[1]	张小娟, 王静静, 董士刚, 林昌健. 锌铝层状双金属氢氧化物焙烧物对钢筋的缓蚀作用研究[J]. 电化学（中英文）, 2013, 19(3): 256-265.
[2]	张哲, 贾明子, 阮乐. 铁表面银纳米粒子自组装膜及其缓蚀性能的研究[J]. 电化学（中英文）, 2012, 18(1): 89-93.
[3]	徐群杰, 李春香, 倪钰宏, 周国定, . 3-氨基-1,2,4-三氮唑和Na_2WO_4复合缓蚀剂对黄铜的缓蚀协同作用[J]. 电化学（中英文）, 2009, 15(2): 190-193.
[4]	王天德, 王荣, 吴霞琴, 郭志钢, 季魏魏, . 锆离子改善十烷基磷酸组装膜结构及性能研究[J]. 电化学（中英文）, 2008, 14(2): 175-179.
[5]	程明焱, 吴伟明, 刘鹤鸣, 杜海燕, . 氨基酸缓蚀剂在盐酸溶液中对钢的缓蚀作用[J]. 电化学（中英文）, 2008, 14(2): 200-204.
[6]	赵景茂, 刘鹤霞, 肖超, 陆原, . 咪唑啉衍生物在H_2S水溶液中的腐蚀抑制机理(英文)[J]. 电化学（中英文）, 2008, 14(1): 18-23.
[7]	刘福国, 杜敏, 王庆璋, . 新型缓蚀剂对钻具在31% NaCl溶液中电化学行为研究[J]. 电化学（中英文）, 2007, 13(4): 382-386.
[8]	陆原;刘鹤霞;赵景茂;. 咪唑啉衍生物在含CO_2的模拟深层气井水溶液中缓蚀机理(英文)[J]. 电化学（中英文）, 2007, 13(3): 242-248.
[9]	卜雪涛;梁广川;李翠;. 锌电极有机复配缓蚀剂的性能研究[J]. 电化学（中英文）, 2006, 12(2): 199-204.
[10]	徐群杰;周国定;王会峰;蔡文斌;. 聚天冬氨酸和钨酸钠复配对3%NaCl溶液中白铜B10的缓蚀作用[J]. 电化学（中英文）, 2006, 12(1): 65-68.
[11]	曲文娟;杜荣归;林昌健;. EDA对铜在稀盐酸中的缓蚀效果及硫离子的影响[J]. 电化学（中英文）, 2006, 12(1): 50-54.
[12]	赵冰;杜荣归;林昌健;. 三种有机缓蚀剂对钢筋阻锈作用的电化学研究[J]. 电化学（中英文）, 2005, 11(4): 382-386.
[13]	崔荣静,谷宁,李春梅. 硫酸溶液中聚天冬氨酸对碳钢的吸附缓蚀性能[J]. 电化学（中英文）, 2005, 11(3): 294-297.
[14]	赵景茂,刘鹤霞,狄伟,左禹. 咪唑啉衍生物与硫脲之间的缓蚀协同效应研究[J]. 电化学（中英文）, 2004, 10(4): 440-445.
[15]	公平, 杜敏, 王庆璋, 穆振军. 天然海水中绿色碳钢缓蚀剂的研究[J]. 电化学（中英文）, 2003, 9(4): 416-421.