亚硫酸盐无氰电沉积金新工艺及机制

doi:10.13208/j.electrochem.2213005

摘要/Abstract

摘要：

直接以氯金酸作为主盐、羟基乙叉二膦酸（HEDP）作为镀液稳定剂和镀层细化剂、结合添加剂, 组成亚硫酸盐无氰镀金新工艺; 研究镀液稳定性、镀层形态及金电沉积机制。结果表明, HEDP可明显提升镀液稳定性;不含HEDP的亚硫酸盐镀金液中, 镀层呈棒状晶粒并随沉积时间延长而逐渐生长,导致镀层外观随镀层厚度增加由金黄色转变为红棕色。镀液含有HEDP时, 金晶粒形态由棒状转变为棱锥状, 且棱锥状晶粒随沉积时间延长生长速率较小, 镀层厚度为1 μm时仍呈现金外观。电化学实验表明金电沉积不经历成核过程。

关键词: 无氰镀金, 亚硫酸金, 羟基乙叉二膦酸, 电沉积, 金镀层

Abstract:

A novel cyanide-free gold sulfite process is introduced in this paper. In the bath, chloauric acid was directly employed as the main salt, and hydroxyethylidene diphosphonic acid (HEDP) was used as the stabilizer and coating grain refiner. The bath stability, the gold coating morphology and the mechanism of gold electrodeposition were studied in detail. The results showed that HEDP could significantly improve the bath stability. Moreover, the grains of the gold coating obtained from the gold sulfite bath without HEDP was rod-like, which grew gradually with the increasing of the deposition time, resulting in that the appearance of the coating turned from a golden yellow to a hazy reddish brown by the increase of the coating thickness. As HEDP was introduced into the gold sulfite bath, the gold grains were transformed to pyramidal, and the grain growth rate accompanying the increase of the coating thickness was much slower than that in the gold sulfite bath without HEDP, observing the golden bright appearance within 1 μm thickness. Electrochemical curves indicated that gold electrodeposition did not undergo a nucleation stage.

Key words: cyanide-free gold plating, gold sulfite, hydroxyethylidene diphosphonic acid, electrodeposition, gold coating

杨家强, 金磊, 李威青, 王赵云, 杨防祖, 詹东平, 田中群. 亚硫酸盐无氰电沉积金新工艺及机制[J]. 电化学（中英文）, 2022, 28(7): 2213005.

Jia-Qiang Yang, Lei Jin, Wei-Qing Li, Zhao-Yun Wang, Fang-Zu Yang, Dong-Ping Zhan, Zhong-Qun Tian. Electrodeposition Mechanism and Process of a Novel Cyanide-Free Gold Sulfite Bath[J]. Journal of Electrochemistry, 2022, 28(7): 2213005.

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链接本文: https://electrochem.xmu.edu.cn/CN/10.13208/j.electrochem.2213005

https://electrochem.xmu.edu.cn/CN/Y2022/V28/I7/2213005

图/表 7

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