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电化学(中英文) ›› 2022, Vol. 28 ›› Issue (7): 2213003.  doi: 10.13208/j.electrochem.2213003

所属专题: “电子电镀和腐蚀”专题文章

• 研究论文 • 上一篇    下一篇

特殊整平剂甲基橙在通孔电镀铜的应用

徐佳莹1, 王守绪1,2, 苏元章1, 杜永杰3, 齐国栋4, 何为1,2, 周国云1, 张伟华2, 唐耀2, 罗毓瑶2, 陈苑明1,2,*()   

  1. 1.电子科技大学材料与能源学院,四川 成都 611731
    2.珠海方正科技高密电子有限公司&珠海方正科技多层电路板有限公司,广东 珠海 519175
    3.珠海市能动科技光学产业有限公司,广东 珠海 519050
    4.珠海杰赛科技有限公司,广东 珠海 519175
  • 收稿日期:2022-03-04 修回日期:2022-04-10 出版日期:2022-07-28 发布日期:2022-05-24

Investigation of Through-Hole Copper Electroplating with Methyl Orange as A Special Leveler

Jia-Ying Xu1, Shou-Xu Wang1,2, Yuan-Zhang Su1, Yong-Jie Du3, Guo-Dong Qi4, Wei He1,2, Guo-Yun Zhou1, Wei-Hua Zhang2, Yao Tang2, Yu-Yao Luo2, Yuan-Ming Chen1,2,*()   

  1. 1. School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 611731, Sichuan, China
    2. Zhuhai Founder Sci-Tech High-density Electronics Co., Ltd and Zhuhai Founder Sci-Tech Multilayer Circuit Board Co., Ltd., Zhuhai 519175, Guangdong, China
    3. Zhuhai Dynamic Technology Optical Industry Co., Ltd, Zhuhai 519050, Guangdong, China
    4. GCI Science & Technology(Zhuhai)Co., Ltd, Zhuhai 519175, Guangdong, China
  • Received:2022-03-04 Revised:2022-04-10 Published:2022-07-28 Online:2022-05-24
  • Contact: * (86)18980602785, E-mail: ymchen@uestc.edu.cn

摘要:

甲基橙具有两种基团,可以同时起到加速和抑制作用,可作为特殊的整平剂应用与通孔电镀铜实验中。通过分子动力学模拟和量子化学计算来表征甲基橙在通孔电镀铜中的作用,结果表明甲基橙可以很好地吸附在阴极表面并抑制铜的电沉积。 通过恒电流测试和循环伏安测试结果显示, 甲基橙由于同时具有磺酸基的去极化和其分子结构部分的极化作用, 形成协同分子内对铜加速还原和阻碍传质的竞争效应, 所以几乎不影响电位。在板厚孔径为10:1的通孔电镀铜实验中, 仅以甲基橙和环氧乙烷和环氧丙烷嵌段共聚物作为添加剂, TP值可达到92.34%。

关键词: 电镀铜, 通孔, 添加剂, 甲基橙

Abstract:

Methyl Orange (MO) with two kinds of functional groups can act as both an accelerator and an inhibitor, which has been used as a special leveler to simplify the electroplating additive system in the through-hole (TH) copper electroplating experiments. In this work, the role of MO in TH electroplating is characterized by molecular dynamics simulations and quantum chemical calculations. It is suggested that MO can spontaneously flatten the copper surface and be well adsorbed on the cathode surface, which inhibit the copper electrodeposition on the cathode. Electrochemical behavior of MO was evaluated by galvanostatic measurements (GM) and cyclic voltammetry (CV) to confirm that MO hardly affects the potential due to its duel functions of depolarizing and polarizing effects from the molecular structure of sulfonic acid group and other groups to achieve the internal Cu2+ reduction acceleration and mass transfer inhibition. Throw power value of TH with the aspect ratio of 10:1 could reach 92.34% from the base plating solution bath with the additions of only EO/PO and MO. The study of MO could provide new ideas for the development of electroplating additive system.

Key words: copper electroplating, through-hole, additive, methyl orange