特殊整平剂甲基橙在通孔电镀铜的应用
徐佳莹, 王守绪, 苏元章, 杜永杰, 齐国栋, 何为, 周国云, 张伟华, 唐耀, 罗毓瑶, 陈苑明
Investigation of Through-Hole Copper Electroplating with Methyl Orange as A Special Leveler
Jia-Ying Xu, Shou-Xu Wang, Yuan-Zhang Su, Yong-Jie Du, Guo-Dong Qi, Wei He, Guo-Yun Zhou, Wei-Hua Zhang, Yao Tang, Yu-Yao Luo, Yuan-Ming Chen
电化学（中英文）
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2022, (7): 2213003
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DOI: 10.13208/j.electrochem.2213003
