络合剂和添加剂对化学镀铜影响的电化学研究

电化学（中英文） ›› 2004, Vol. 10 ›› Issue (1): 14-19.

络合剂和添加剂对化学镀铜影响的电化学研究

谷新,王周成,林昌健

固体表面物理化学国家重点实验室厦门大学化学系材料科学与工程系,固体表面物理化学国家重点实验室厦门大学化学系材料科学与工程系,固体表面物理化学国家重点实验室厦门大学化学系材料科学与工程系福建厦门361005 ,福建厦门361005 ,福建厦门361005

收稿日期:2004-02-28 修回日期:2004-02-28 出版日期:2004-02-28 发布日期:2004-02-28

An Electrochemical Study of the Effects of Chelating Agents and Additives on Electroless Copper Plating

GU Xin, WANG Zhou-Cheng, LIN Chang-Jian~* . and Eng., Xiamen Univ., 361005, China)

Received:2004-02-28 Revised:2004-02-28 Published:2004-02-28 Online:2004-02-28

摘要/Abstract

摘要： 　以CuSO4·5H2O作主盐,乙二胺四乙酸二钠盐(Na2EDTA)作主络合剂,三乙醇胺(TEA)作辅助络合剂,2,2′＿联吡啶(dipyridine)作添加剂,组成化学镀铜液体系,研究络合剂、添加剂对该镀液电化学极化性能的影响,并结合化学沉积速率考察TEA和2,2′＿联吡啶对镀液性能的影响.

关键词: 化学镀铜, 络合剂, 添加剂, 极化, 峰电流值

Abstract: In this study, ethylenediaminetetraacetic acid disodium salt (Na_2EDTA), triethanolamine(TEA), and 2,2′-dipyridine were adopted as chelating agents or additives in the electrolyte for electroless copper plating, and formaldehyde (HCHO) was as the reducting agent. Linear sweep voltammetry was applied to analyze the polarization behavior. The peak current of formaldehyde oxidation which increased by the addition of 2,2′-dipyridine is beneficial to formaldehyde oxidation in a specific range of concentration, While TEA decreased the peak current of formaldehyde oxidation. Two cathodic peaks due to copper(Ⅱ)reduction of TEA chelatation and copper(Ⅱ)reduction of EDTA chelatation were examined. EDTA increased the reduction peak current of Cu-EDTA and decreases that of Cu-TEA, While TEA increased the reduction peak current of Cu-TEA, and it decreased that of Cu-EDTA. The addition of 2,2′-dipyridine also decreases the reduction peak current of Cu-TEA. The experimental results are in agreement with the results obtained by weight gain measurement.

Key words: Electroless copper plating, Chelating agents, Additives, Polarization, Peak current.

中图分类号:

O646

谷新,王周成,林昌健. 络合剂和添加剂对化学镀铜影响的电化学研究[J]. 电化学（中英文）, 2004, 10(1): 14-19.

GU Xin, WANG Zhou-Cheng, LIN Chang-Jian~* . and Eng., Xiamen Univ., 361005, China). An Electrochemical Study of the Effects of Chelating Agents and Additives on Electroless Copper Plating[J]. Journal of Electrochemistry, 2004, 10(1): 14-19.

导出引用管理器 EndNote|Ris|BibTeX

链接本文: https://electrochem.xmu.edu.cn/CN/

https://electrochem.xmu.edu.cn/CN/Y2004/V10/I1/14

参考文献

[1]　MatsuokaM,YoshidaY,IwakuraC,etal.Theeffectsofaerationandaccumulationofcarbonateionsonthemechanicalpropertiesofelectrolesscoppercoatings[J].JElectrochemSoc.,1995,142(1):87～91. [2]　LinWH,ChangHF.Effectofchelatingagentsonthestructureofelectrolesscoppercoatingonaluminapowder[J].Surf.andCoatingsTech.,1998,107:48～54. [3]　KouS＿C,HungA.Effectof2,2′＿dipyridineonborate＿bufferedelectrolesscopperdeposition[J].Plat＆SurfFinish,2003,90(3):44～47. [4]　LinYM,YenSC.Effectsofadditivesandchelatingagentsonelectrolesscopperplating[J].Appl.Surf.Sci.,2001,178:116～126. [5]　KouSC,HungA.Effectofbufferonelectrolesscopperdeposition[J].Plat＆SurfFinish,2002,89(2):48～52. [6]　DongC,DongGL,ZhouWZ,etal.Polarizationcharacteristicsofelectrolesscopperplaingbathscontainingcomplexingagents[J].MaterialsProtection,1996,29(9):7～9. [7]　DongC,DongGL,ZhouWZ,etal.Astudyontheeffectsoftheadditiveselectrolesscopperdepositionbyelectrochemicalmethod[J].MaterialsProtection,1997,30((1):8＿10. [8]　Kondo,Koji,Murakawa,etal.Electrolesscopperplatingsolutionandprocessforelectrolesslyplatingcopper[P].U.S.Pat.4834796,1989. [9]　Kondo,Koji,Amakusa,etal.Electrolesscopperplatingsolutionandprocessforformationofcopperfilm[P].U.S.Pat.5039338,1991. [10]　NuzziFJ.Acceleratingtherateofelectrolesscopperplating[J].Plat＆SurfFinish,1983,70(1):51～54. [11]　HungA.Effectsofthioureaguanidinehydrochlorideonelectrolesscopperplating[J].J.Electrochem.Soc.,1985,132(5):1047～1049. [12]　BindraP,RoldanJ.Mechanismofelectrolessmetalplating(Ⅱ.Formaldehydeoxidation)[J].J.Electrochem.Soc.,1985,132:2581＿2589. [13]　BurkeLD,AhernMJG.,RyanTG.AninvestigationoftheanodicbehaviorofcopperanditsanodicallyproducedoxidesinaqueoussolutionsofhighpH[J].J.Electrochem.Soc.,1990,137:553～561. [14]　HeJB,LinJX.AstudyofanodicprocessofcopperinNaOHsolution[J].ChemicalJournalofChineseUniversities,1996,2:290～293. [15]　KondoK,IshidaN,IshikawaJ,etal.Kineticsofelectrolesscopperplatinginthepresenceofexcesstriethanolamine[J].Bull.Chem.Soc.Jpn.,1992,65:1313～1316.