关键词: 硅, 侵刻, 溶解, 表面结构, 器件加工, 表面反应, 微机电系统

Abstract: Accurate control and fabrication of silicon surface structures from atomic scale to micrometer scale,which may be randomly associated with surface roughness or have well defined patterns,is critical for the per-formance and reliability of electronic devices.Electrochemical reactions of silicon in solutions involved in wetcleaning and etching of silicon wafer play an importantrole in determining the structures of silicon surface.Atre-mendous amount of researches have been done in the last several decades to understand and control a range ofcomplex electrochemical reactions at silicon/solution interface and their relations to the resulted surface struc-tures.The findings generated from these research efforts have been compiled and integrated in a recently pub-lished book.This paper is to present an overview,using synthesized information from this book,on the aspect ofsilicon dissolution and the resulted surface structures.