[1]Cui Zuo-xing(崔作兴),Gu Yun-fei(顾云飞),ShaoZhong-cai(邵忠财),et al.Electroless plating of nickelon magnesium alloy AZ91D with pre-phosphorization[J].Corrosion Science and Protection Technology(腐蚀科学与防护技术),2010,22(1):74-76.
[2]Liao Yi-feng(廖一峰),Mao Gui-sheng(毛桂生),Huang Yuan-sheng(黄元盛).Structure and perform-ances of electroless Ni-P alloy coating on thermostat[J].Tractor&Farm Transporter(拖拉机与农用运输车),2010,37(2):87-88.
[3]Chen C Y,Lin K Y,Tsai W T,et al.Electroless deposi-tion of Ni nanoparticles on carbon nanotubes with theaid of supercritical CO2fluid and a synergistic hydrogenstorage property of the composite[J].International Jour-nal of Hydrogen Energy,2010,35(11):5490-5497.
[4]Kar K K,Sathiyamoorthy D.Influence of process param-eters for coating of nickel-phosphorous on carbon fibers[J].Journal of Materials Processing Technology,2009,209(6):3022-3029.
[5]Lee C K.Structure,electrochemical and wear-corrosionproperties of electroless nickel-phosphorus deposition onCFRP composites[J].Materials Chemistry and Physics,2009,114(1):125-133.
[6]Boulord C,Kaminski A,Canut B,et al.Electrical andstructural characterization of electroless nickel-phos-phorus contacts for silicon solar cell metallization[J].Journal of the Electrochemical Society,2010,157(7):H742-H745.
[7]Li J,Wang L J,Liu H B.A new process for preparingconducting wood veneers by electroless nickel plating[J].Surface&Coatings Technology,2010,204(8):1200-1205.
[8]Cui X F,Jin G,Li Q F,et al.Electroless Ni-P platingwith a phytic acid pretreatment on AZ91D magnesiumalloy[J].Materials Chemistry and Physics,2010,121(1/2):308-313.
[9]Zhang H,Wang S L,Yao G C,et al.Electroless Ni-Pplating on Mg-10Li-1Zn alloy[J].Journal of Alloys andCompounds,2009,474(1-2):306-310.
[10]Elsentriecy H H,Azumi K.Electroless Ni-P depositionon AZ91 D magnesium alloy prepared by molybdatechemical conversion coatings[J].Journal of the Elec-trochemical Society,2009,156(2):D70-D77.
[11]Gou Yin-ning(沟引宁),Huang Wei-jiu(黄伟九),Chen Wen-bin(陈文彬),et al.Environmental elec-troless nickel plating technology on magnesium alloy insolution with NiSO4as main salt[J].Corrosion&Pro-tection(腐蚀与防护),2010,31(3):225-228.
[12]Hu Bo-nian(胡波年),Li Ting-jing(李亭憬),YuGang(余刚),et al.Bath stability of electroless platingnickel on magnesium alloys[J].CIESC Journal(化工学报),2009,60(3):696-701.
[13]Vojtech D,Novak M,Zelinkova M,et al.Structural evo-lution of electroless Ni-P coating on Al-12 wt.%Si al-loy during heat treatment at high temperatures[J].Ap-plied Surface Science,2009,255(6):3745-3751.
[14]He Zhong-chen(贺忠臣),Ding Yi(丁毅),Qin Tie-nan(秦铁男),et al.Effect of heat treatment tempera-ture on corrosion resistance of electroless nickel platingon 6063 aluminum alloy[J].Corrosion&Protection(腐蚀与防护),2010,31(3):231-233.
[15]Mahmoud S S.Electroless deposition of nickel and cop-per on titanium substrates:Characterization and appli-cation[J].Journal of Alloys and Compounds,2009,472(1/2):595-601.
[16]Hao L,Wei J,Gan F X.Electroless Ni-P coating on W-Cu composite via three different activation processes[J].Surface Engineering,2009,25(5):372-375.
[17]Wang LL,Chen HJ,Huang W Q,et al.Electroless Ni-P coating on W-Cu alloy via potential activation process[J].Surface Engineering,2009,25(5):376-381.
[18]Zheng Zhen(郑臻),Yu Xin-quan(余新泉),SunYang-shan(孙扬善),et al.Study of environmentallyacceptable electroless nickel plating technology formagnesium alloy[J].Materials Protection(材料保护),2006,39(8):22-25.
[19]Wang Han-ying(王憨鹰),Chen Huan-ming(陈焕铭),Sun An(孙安),et al.The influence of brighteneron the electroless plating Ni2P alloy coatings[J].Sur-face Technology(表面技术),2008,37(3):14-15.
[20]Alan Ruffini,Yang Da-sheng(杨达生).Environmentprotection electroless nickel plating technics accordingwith the RoHS and ELV European union directive[J].Electroplating and Finishing(电镀与涂饰),2007,26(10):25-28.
[21]Hu Pei-yu(胡佩瑜),Cheng Dan-hong(成旦红),LiKe-jun(李科军),et al.Study on high speed Ni-P alloyelectroless plating technology in lead-free and cadmi-um-free bath[J].Plating and Finishing(电镀与精饰),2008,30(9):39-42.
[22]He Xiang-ming(何向明),Fan Wen-xue(范文学),Liu Yin(刘殷),et al.Novel electroless nickel platingprocess[J].Electroplating and Finishing(电镀与涂饰),2009,28(12):28-31.
[23]Zheng Zhen(郑振),Li Ning(李宁),Li De-yu(黎德育).Effects of stabilizers on stability of low-P electro-less nickel bath and deposit[J].Electroplating&Pol-lution Control(电镀与环保),2009,29(1):30-33.
[24]Dong Kun(董坤),Li De-liang(李德良),Wu Gan-hong(吴赣红).Study on lead-free stabilizer for elec-troless nickel plating[J].Surface Technology(表面技术),2008,37(3):12-13.
[25]Chen Zhi-dong(陈智栋),Liu Qi-fa(刘启发),WangWen-chang(王文昌),et al.Effect of Zn2+as a stabi-lizer on the stability of electroless nickel plating bath[J].Materials Protection(材料保护),2008,41(4):33-35.
[26]Liu Hai-ping(刘海萍),Li Ning(李宁),Bi Si-fu(毕四富),et al.Study on lead-and cadmium-free compos-ite additive for electroless nickel plating[J].Electro-plating&Finishing(电镀与涂饰),2008,27(3):19-21.
[27]Lei A-li(雷阿利),Feng La-jun(冯拉俊).Study oncomposite accelerator for electroless nickel-phosphorusalloy plating[J].Electroplating&Finishing(电镀与涂饰),2008,27(5):19-21.
[28]Choudhury B S,Sen R S,Oraon B,et al.Statisticalstudy of nickel and phosphorus contents in electrolessNi-P coatings[J].Surface Engineering,2009,25(5):410-414.
[29]Yang Fang-zu(杨防祖),Yang Bin(杨斌),Lu Bin-bin(陆彬彬),et al.Electrochemical study on electrolesscopper plating using sodium hypophosphite as reduc-tant[J].Acta Phys-Chim Sin(物理化学学报),2006,22(11):1317-1320. |