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电化学(中英文) ›› 2003, Vol. 9 ›› Issue (3): 327-335. 

• 研究论文 • 上一篇    下一篇

化学沉积镍-铁-磷合金和它的伏安行为(英文)

王森林,吴辉煌   

  1. 华侨大学材料科学与工程学院,厦门大学化学系,固体表面物理化学国家重点实验室 福建泉州362011 ,福建厦门361005
  • 收稿日期:2003-08-28 修回日期:2003-08-28 出版日期:2003-08-28 发布日期:2003-08-28

The Electroless Plating Ni-Fe-P Alloy and Its Voltammetric Behavior

WANG Sen_lin 1* , WU Hui_huang 2   

  1. ( 1.College of materials science and engineering,Huaqiao university,Quanzhou 362011, China, 2.State key laboratory for physical chemistry of solid surface,Department of chernistry, Xiamen university, Xiamen 361005, China
  • Received:2003-08-28 Revised:2003-08-28 Published:2003-08-28 Online:2003-08-28

摘要: 在以次亚磷酸钠为还原剂 ,硼酸为缓冲剂和柠檬酸钠为络合剂的碱性介质中 ,研究了镍_铁_磷合金化学沉积条件 (pH值 ,温度及 [Fe2 + ]/([Ni2 + ]+[Fe2 + ])物质的量比 )对沉积速率和镀层组成的影响 ;并由此建立镀液稳定的最佳沉积工艺 .实验表明 ,镀液中硫酸亚铁对沉积镍_铁_磷合金有阻碍作用 (降低了化学沉积速率 ) ,造成镀层中铁含量不高 (小于 2 0 % ) ,使用循环伏安技术研究了镍_铁_磷合金的电沉积机理 .结果发现铁对次亚磷酸钠的氧化不起催化作用 ,提高镀液温度和pH值有增加沉积速率之效

关键词: 化学沉积, 镍-铁-磷合金, 循环伏安

Abstract: Electroless Ni_Fe_P alloy deposition from an alkaline bath, containing sodium hypophosphite as reducer, boric acid as buffer agent and sodium citrate as complexing agent, was investigated. To increase the plating rate and to inprove the bath stability, the deposition parameters were optimized. The effects of process parameters (pH,temperature and mole ratio of [Fe 2+ ]/([Ni 2+ ]+[Fe 2+ ]) on the plating rate and deposit composition were examined and it was found that the presence of ferrous sulfate in the bath has an inhibitory effect on the alloy deposition. As a consequence, the per_centage of iron in the electroless Ni_Fe_P alloys never reaches high values which is lower 20.0%. Using cyclic voltammetry the electrodeposition mechanism of Ni_Fe_P alloys was investigated. It was observed that the presence of ferrous sulfate in the bath decreases the deposition rate and the iron doesn′t catalyst on the oxidation of hypophosphite. However, the increase in temperature or pH leads to improving the deposition rate.

Key words: Electroless deposition, Ni_Fe_P alloys, Cyclic voltammetry

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