关键词: Sb, Cu(100), Cu(111), 欠电位沉积, 现场STM

Abstract: We report electrochemical and in_situ STM studies on Sb UPD onto Cu(111) and Cu(100) electrode surfaces in HClO4 and H2SO4 solutions. The results indicate that the electrode surface structure as well as anion can considerably influence Sb UPD. Sb UPD on Cu(100) forms open adlayer structures, which is accompanied by surface alloying due to the more open structure of the (100) surface, On Cu(111), a more compact Sb adlayer is formed instead. Anion adsorption influences the dynamics as well as the adlayer structure of Sb UPD. Owing to the strong adsorption of SO42-, the UPD of Sb on Cu(111) in H2SO4 solution initiates at the edge of the terrace followed by spreading towards the centre of the terrace. But in HClO4 solution, atomic height Sb islands are formed on Cu(111). On Cu(100), a (22×22) R45°( superstructure is formed in HClO4 solution. In contrast, a (4×4)superstructure is observed in co_adsorption with SO42- in H2SO4 solution.