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电化学(中英文) ›› 1997, Vol. 3 ›› Issue (2): 174-178. 

• 研究论文 • 上一篇    下一篇

Ni-Mo合金电沉积层织构及形成机理

黄令,许书楷,汤皎宁,杨防祖,周绍民   

  1. 厦门大学化学系
  • 收稿日期:1997-05-28 修回日期:1997-05-28 出版日期:1997-05-28 发布日期:1997-05-28

Mechanism and Texture of Ni Mo Alloy Electrodeposition

Huang Ling * Xu Shukai Tang Jaoning Yang Fangzu Zhou Shaomin   

  1. (Dept. of Chem. Xiamen Univ., Xiamen 361005
  • Received:1997-05-28 Revised:1997-05-28 Published:1997-05-28 Online:1997-05-28

摘要: 在组成为:0.22mol/L硫酸镍、0.06mol/L钼酸钠和0.3mol/L柠檬酸钠的溶液,于纯铜片上采用恒电流沉积,所得Ni-Mo合金沉积层经X射线衍射测定,结果表明在温度为25℃~50℃,电流密度为10mA·cm-2~30mA·cm-2范围,Ni-Mo合金沉积层表现为(111)择优取向.循环伏安和电位阶跃实验表明镍钼合金电结晶过程按照连续成核和三维生长方式进行.Ni-Mo合金电沉积过程的电化学交流阻抗谱表明Ni-Mo共沉积过程经历了吸附中间产物步骤,由于吸附态物种氢氧化镍和钼的氧化物将阻化晶粒(111)晶面的生长,从而使镍钼沉积层表现为(111)择优取向.

关键词: Ni-Mo合金电沉积, 织构, 电结晶机理

Abstract: Ni Mo alloy deposits with (111) preferred orientation was obtained in a solution of 0.22 mol/L NiSO 4·6H 2O, 0.06 mol/L Na 2MoO 4·2H 2O and 0.3 mol/L Na 3C 6H 5O 7·2H 2O in temperature from 25℃ to 50℃,and current densities ranged from 10 mA·cm -2 to 30 mA·cm -2 . The electrodeposition of Ni Mo alloy was studied by cylic voltammetry and potential step experiment. It was shown that Ni Mo alloy is formed by mechanism involving progressive nucleation followed by three dimensional growth of the metal centres. The complex plane impedance plots indicate codeposition of Ni Mo alloy involves the intermediate adion. The growth of (111) plane of crystallite is inhibited with adsorption of (NiOH) ads and MoO 2, So Ni Mo alloy deposit exhibits (111) preferred orientation.

Key words: Ni Mo alloy electrodeposition, Texture, Electrocrystallization mechanism

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