锦纶织物无钯活化化学镀银工艺及性能研究

doi:10.61558/2993-074X.2858

电化学（中英文） ›› 2011, Vol. 17 ›› Issue (4): 380-387. doi: 10.61558/2993-074X.2858

锦纶织物无钯活化化学镀银工艺及性能研究

孟云，赵亚萍，蔡再生*?

东华大学生态纺织教育部重点实验室, 上海 201620

收稿日期:2011-07-05 修回日期:2011-07-28 出版日期:2011-11-28 发布日期:2011-08-10
通讯作者: 蔡再生 E-mail:zshcai@dhu.edu.cn
基金资助:
教育部科学技术研究重点项目资助（109066）；中央高校基本科研业务费专项资金资助(11D10527)

Electroless Plating Silver without Pd Activation on Polyamide Fabrics and Its Properties

MENG Yun，ZHAO Ya ping， CAI Zai sheng*

Key Laboratory of Science & Technology of Eco-Textile , Ministry of Education, Donghua University, Shanghai 201620，China

Received:2011-07-05 Revised:2011-07-28 Published:2011-11-28 Online:2011-08-10
Contact: CAI Zai sheng E-mail:zshcai@dhu.edu.cn

摘要/Abstract

摘要： 应用无钯活化化学镀方法在预制聚苯胺层的锦纶织物上沉积金属银，研究了化学镀条件（主盐硝酸银、还原剂葡萄糖、络合剂氨水、氢氧化钠用量、温度和时间）对金属沉积速率和织物方阻的影响，优化化学镀的最佳工艺为：硝酸银12g/L，葡萄糖 2.8g/L，氨水100ml/L，氢氧化钠8g/L，温度30℃，时间 50min。同时讨论了聚苯胺中间层对金属银晶粒尺寸、织构系数和耐腐蚀等性能影响，结果表明，以聚苯胺作锦纶织物施镀中间层可有效提高金属化织物的导电、耐腐蚀以及耐洗等性能。

关键词: 无钯活化, 化学镀, 银, 聚苯胺, 导电织物

Abstract: Silver was deposited on the surface of polyaniline coated polyamide fabrics by electroless plating without using conventional palladium chloride solution as activator．Effects of electroless plating conditions such as the concentrations of silver nitrate, reducing agent glucose, complexing agent ammonium hydroxide, sodium hydroxide in the bath, as well as the depositing time and bath temperature on the rate of metal deposition and the square resistance were studied. Optimum electroless plating conditions were: 30℃, 50 min, with silver nitrate 12 g/L, ammonium hydroxide 100 ml/L, glucose 2.8 g/L, sodium hydroxide 8 g/L. Meanwhile, effects of the intermediate polyaniline layer on the metal crystallite size, texture and corrosion resistance of composite conducting fabrics were discussed. The results showed that the intermediate polyaniline layer between polyamide fabric and silver could effectively improve the conductance, corrosion resistance and laundry resistance of composite conducting fabrics.

Key words: Pd-free activation, electroless plating, sliver, polyaniline, conducting fabric

中图分类号:

TS195.5

孟云, 赵亚萍, 蔡再生. 锦纶织物无钯活化化学镀银工艺及性能研究[J]. 电化学（中英文）, 2011, 17(4): 380-387.

MENG Yun, ZHAO Ya-Ping, CAI Zai-Sheng. Electroless Plating Silver without Pd Activation on Polyamide Fabrics and Its Properties[J]. Journal of Electrochemistry, 2011, 17(4): 380-387.

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https://electrochem.xmu.edu.cn/CN/Y2011/V17/I4/380

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锦纶织物无钯活化化学镀银工艺及性能研究

Electroless Plating Silver without Pd Activation on Polyamide Fabrics and Its Properties

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