湿化学镀SPR金基底及其性能表征

doi:10.61558/2993-074X.2076

电化学（中英文） ›› 2011, Vol. 17 ›› Issue (1): 31-36. doi: 10.61558/2993-074X.2076

湿化学镀SPR金基底及其性能表征

周宥辰;王艳艳;马志方;姜艳霞;邱瑾;孙世刚;

厦门大学化学化工学院化学系固体表面物理化学国家重点实验室;

收稿日期:2011-02-28 修回日期:2011-02-28 出版日期:2011-02-28 发布日期:2011-02-28

Prepartion and Characterization of SPR Au Substrate Using Wet Chemical Plating

ZHOU You-chen,WANG Yan-yan,MA Zhi-fang,JIANG Yan-xia, QIU Jin,SUN Shi-gang

(Department of Chemistry,College of Chemistry and Chemical Engineering,State Key Lab for Physical Chemistry of Solid Surface,Xiamen University,Xiamen 361005,Fujian,China

Received:2011-02-28 Revised:2011-02-28 Published:2011-02-28 Online:2011-02-28

摘要/Abstract

摘要： 建立一种由单一水相操作的表面等离子体共振法(SPR)制备金基底.即:在3-氨基丙基三甲氧基硅烷(APTMS)修饰的玻璃片上自组装一层细小的金胶纳米粒子,以此为催化模板,利用化学镀技术在纳米尺度范围内控制金膜的均匀增长,获得优异SPR信号响应所需要的金膜形貌和厚度.紫外光谱(UV-vis),透射电镜(TEM)观测表明,纳米金膜催化模板粒径约为2.5 nm.扫描电镜(SEM)观察湿化学镀SPR金基底均匀分布,粒径约为40 nm.与商品化真空镀金基底相比,湿化学镀金基底对乙醇的SPR响应强度相当,且可调控性更高.

关键词: 表面等离子体共振光谱(SPR), 湿化学镀法, 自制SPR金基底, 商业SPR金基底

Abstract: The present study developed a preparation method of SPR gold substrate based on water phase operation.Firstly,on the glass modified by APTMS we self-assembed a gold colloid monolayer as the catalyst bed;Secondly,using the chemical plating technique,we made the gold film increase equably within the namometer range to obtain the proper shape and thinkness of the gold film required by the SPR.The analysis results of UV-vis and TEM demonstrated that the diameter of the monolayer formed from gold nanoparticles was 2.5 nm.Moreover,SEM showed that the nanoparticle prepared by electroless gold plating was uniformly distributed,whose diameter was 40 nm.The SPR flow injection experiment found that the response intensity of the SPR Au substrate made by wet chemical plating was as strong as that of the commercial SPR Au substrate made by vacuum sputtering,and the former one was more preferable to adjust the surface structure of the gold film than the later one.

Key words: surface plasmon resonance(SPR), wet chemical plating, homemade SPR Au substrate, commercial SPR Au substrate

中图分类号:

O646

周宥辰, 王艳艳, 马志方, 姜艳霞, 邱瑾, 孙世刚, . 湿化学镀SPR金基底及其性能表征[J]. 电化学（中英文）, 2011, 17(1): 31-36.

ZHOU You-chen, WANG Yan-yan, MA Zhi-fang, JIANG Yan-xia, QIU Jin, SUN Shi-gang. Prepartion and Characterization of SPR Au Substrate Using Wet Chemical Plating[J]. Journal of Electrochemistry, 2011, 17(1): 31-36.

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链接本文: https://electrochem.xmu.edu.cn/CN/10.61558/2993-074X.2076

https://electrochem.xmu.edu.cn/CN/Y2011/V17/I1/31

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湿化学镀SPR金基底及其性能表征

Prepartion and Characterization of SPR Au Substrate Using Wet Chemical Plating

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