电化学（中英文） ›› 1996, Vol. 2 ›› Issue (3): 310-313. doi: 10.61558/2993-074X.1341
• 研究论文 • 上一篇 下一篇
韩克平，方景礼
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Han Keping;Fang Jingli
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摘要： 测定了化学抛光过程中紫铜的表面光反射率、失重、表面形貌和电位随时间的变化以及抛光过程的电流－电位曲线。结果表明，紫铜的化学抛光过程由浸蚀，光亮和过腐蚀三个阶段组成。电抛光的钝化膜理论也同样适用于紫铜的化学抛光．
关键词: 紫铜, 化学抛光, 光反射率, 表面形貌
Abstract: Changes in specular reflectivity,weight loss,surface topograph and potential with time and current-potential curves during chemical polishing were determined.The results showed that chemical polishing was composed of the etching,polishing and pitting stage.The passivating film theory also applied to the chemical polishing.
中图分类号:
TG175.3
韩克平, 方景礼. 紫铜化学抛光的电化学研究[J]. 电化学（中英文）, 1996, 2(3): 310-313.
Han Keping, Fang Jingli. Electrochemical Studies on Chemical Polishing of Copper[J]. Journal of Electrochemistry, 1996, 2(3): 310-313.
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链接本文: https://electrochem.xmu.edu.cn/CN/10.61558/2993-074X.1341
https://electrochem.xmu.edu.cn/CN/Y1996/V2/I3/310
