The fabrication resolution of electrochemical wet stamping (E-WETS) was enhanced to several hundred nanometers from several ten micrometers by using polycarylamide gel (PAG) as soft stamps and through optimized processes. The PAG stamp was cured on a nanopatterned soft mold and soaked with 0.2 mol·L^-1 KCl solution, then contacted with a silicon wafer with gold film and applied with electric field. And the gold nanopatterns were achieved by the selective anodic dissolving, the diameter of fabricated gold spot was around 200 nm. The parameters which affected the fabrication processes have been discussed in detail.