电化学（中英文） ›› 1995, Vol. 1 ›› Issue (1): 93-96. doi: 10.61558/2993-074X.1270
• 研究论文 • 上一篇 下一篇
周春根，段淑贞
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Zhou Chungen;Duan Shuzhen
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摘要： 钇离子在铜电极上的电极过程及表面合金化周春根，段淑贞（北京科技大学理化系，北京１０００８３）通过熔盐电化学表面合金化方法获得的镀层非常均匀、无裂纹，具有很强的抗腐蚀性能，其原因是获得的合金镀层系由一种金属原子向另一种基体金属表面扩散的结果￣［１，２］...
Abstract: The reduction of yttrium ion on copper electrode in NaCl-KCl-YCl_3 molten saltshas been investigated.The results indicate that the formation of intermetallic compounds is occuredbefore the metallic yttrium to be formed.The formation of intermetallic compounds is controlled bythe process of which yttrium atoms are diffusing into copper electrode.The kinetic characters todiffusion of yttrium atoms were also discussed.
中图分类号:
O614.322
周春根, 段淑贞. 钇离子在铜电极上的电极过程及表面合金化[J]. 电化学（中英文）, 1995, 1(1): 93-96.
Zhou Chungen, Duan Shuzhen. The Electrode Process of Y(Ⅲ) on Copper Electrode and Its Surface Metallizing[J]. Journal of Electrochemistry, 1995, 1(1): 93-96.
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https://electrochem.xmu.edu.cn/CN/Y1995/V1/I1/93
