钇离子在铜电极上的电极过程及表面合金化

电化学（中英文） ›› 1995, Vol. 1 ›› Issue (1): 93-96.

钇离子在铜电极上的电极过程及表面合金化

周春根，段淑贞

北京科技大学理化系，北京航空航天大学１０３教研室

收稿日期:1995-02-28 修回日期:1995-02-28 出版日期:1995-02-28 发布日期:1995-02-28

The Electrode Process of Y(Ⅲ)on Copper Electrode and Its Surface Metallizing

Zhou Chungen;Duan Shuzhen

(Department of Physical Chemistry,Univeraity of Science and Technology Beijing, Beijing 100083

Received:1995-02-28 Revised:1995-02-28 Published:1995-02-28 Online:1995-02-28

摘要/Abstract

摘要： 钇离子在铜电极上的电极过程及表面合金化周春根，段淑贞（北京科技大学理化系，北京１０００８３）通过熔盐电化学表面合金化方法获得的镀层非常均匀、无裂纹，具有很强的抗腐蚀性能，其原因是获得的合金镀层系由一种金属原子向另一种基体金属表面扩散的结果￣［１，２］...

Abstract: The reduction of yttrium ion on copper electrode in NaCl-KCl-YCl_3 molten saltshas been investigated.The results indicate that the formation of intermetallic compounds is occuredbefore the metallic yttrium to be formed.The formation of intermetallic compounds is controlled bythe process of which yttrium atoms are diffusing into copper electrode.The kinetic characters todiffusion of yttrium atoms were also discussed.

Key words: Yttrium, Electrode process, Metallizing, Cyclic voltammetry

中图分类号:

O614.322

周春根，段淑贞. 钇离子在铜电极上的电极过程及表面合金化[J]. 电化学（中英文）, 1995, 1(1): 93-96.

Zhou Chungen;Duan Shuzhen. The Electrode Process of Y(Ⅲ)on Copper Electrode and Its Surface Metallizing[J]. Journal of Electrochemistry, 1995, 1(1): 93-96.

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