酸性化学镀镍磷合金的动力学机理

doi:10.13208/j.electrochem.140321

电化学（中英文） ›› 2014, Vol. 20 ›› Issue (6): 576-581. doi: 10.13208/j.electrochem.140321

• 研究论文 • 上一篇

酸性化学镀镍磷合金的动力学机理

谢治辉^1*, 余刚^2*

1. 西华师范大学化学化工学院，化学合成与污染控制四川省重点实验室，四川南充 637002；2. 湖南大学化学化工学院，化学生物传感与计量学国家重点实验室，湖南长沙410082

收稿日期:2014-03-21 修回日期:2014-03-21 出版日期:2014-12-28 发布日期:2014-04-10
通讯作者: 谢治辉, 余刚 E-mail:zhihuixie@yeah.net; yuganghnu@163.com
基金资助:
四川省教育厅自然科学项目（No. 14ZB0147）和中央高校基本科研业务费专项（No. 13E006）资助

Kinetics and Mechanism of Acidic Electroless Ni-P Plating

XIE Zhi-hui^1*, YU Gang^2*

1. Chemical Synthesis and Pollution Control Key Laboratory of Sichuan Province, College of Chemistry and Chemical Engineering , China West Normal University, Nanchong 637002, Sichuan, China; 2. State Key Laboratory of Chemo/Biosensing and Chemometrics, College of Chemistry and Chemical Engineering, Hunan University, Changsha 410082, China

Received:2014-03-21 Revised:2014-03-21 Published:2014-12-28 Online:2014-04-10
Contact: XIE Zhi-hui, YU Gang E-mail:zhihuixie@yeah.net; yuganghnu@163.com

摘要/Abstract

摘要： 通过极化曲线研究了3种不同溶液（阴极液、阳极液和完整镀液）的电化学行为，测定了主盐、还原剂浓度以及镀液pH和体系温度对化学镀镍沉积速率的影响. 与直接在镁合金上化学镀镍并使用重量分析法得到的沉积速率相比较发现，完整镀液体系的极化曲线才能真实地反映化学镀镍的沉积过程，其过程不能简单视为由彼此完全独立毫无关联的阴阳极半反应构成. 根据Butler-Volmer公式，本化学镀液体系的化学镀镍过程属混合控制，其表观反应活化能为42.89 kJ·mol^-1.

关键词: 化学镀, 极化, 电化学机理, 混合电势理论, 沉积速率

Abstract: Electrochemical behaviors of electroless nickel (EN) plating in three systems, namely, cathodic, anodic and complete bath solutions were investigated by polarization methods. The curves in the complete baths were not entirely consistent with those expected from a combination of the anodic and cathodic polarization curves, which implies that the anodic and cathodic reactions of the EN plating are interdependent. The effects of concentration of nickel ions, hypophosphite and pH on the polarization parameter and deposition rate in a complete bath were also discussed and compared by performing electrochemical and gravimetrical measurements. Based on these variations in the deposition potential and current density, a kinetic expression employing the Butler-Volmer equation is suggested and verified with the experimental findings. It was confirmed that the electroless nickel deposition processes in the present system was under a mixed control. The apparent activation energy determined by electrochemical methods was about 42.89 kJ·mol^-1.

Key words: electroless plating, polarization, electrochemical mechanism, mixed potential theory, deposition rate

中图分类号:

TQ153

谢治辉*, 余刚*. 酸性化学镀镍磷合金的动力学机理[J]. 电化学（中英文）, 2014, 20(6): 576-581.

XIE Zhi-hui*, YU Gang*. Kinetics and Mechanism of Acidic Electroless Ni-P Plating[J]. Journal of Electrochemistry, 2014, 20(6): 576-581.

导出引用管理器 EndNote|Ris|BibTeX

链接本文: https://electrochem.xmu.edu.cn/CN/10.13208/j.electrochem.140321

https://electrochem.xmu.edu.cn/CN/Y2014/V20/I6/576

参考文献

[1]Alkire R C, Kolb D M. Advances in electrochemical science and engineering (vol. 7)[M]. Weinheim: Wiley-VCH Verlag GmbH, 2001: Chapter 5.
[2]Paunovic M, Vitkavage D. Determination of electroless copper deposition rate from polarization data in the vicinity of the mixed potential[J]. Journal of the Electrochemical Society, 1979, 126(12): 2282-2284.
[3]Ohno I. Electroless copper plating from an iminodiacetate bath[J]. Surface Technology, 1976, 4(6): 515-520.
[4]Hung A, Ohno I. Electrochemical study of hypophosphite-reduced electroless copper deposition[J]. Journal of the Electrochemical Society, 1990, 137(3): 918-921.
[5]Inberg A, Bogush V, Croitoru N, et al. Electrochemical study of the mechanism of Ag(W) electroless deposition[J]. Journal of the Electrochemical Society, 2007, 154(1): D1-D4.
[6]Petrov N, Sverdlov Y, Shacham-Diamand Y. Electrochemical study of the electroless deposition of Co(P) and Co(W, P) alloys[J]. Journal of the Electrochemical Society, 2002, 149(4): C187-C194.
[7]Kato M, Niikura K, Hoshino S, et al. Electrochemical behavior of electroless gold plating with ascorbic acid as a reducing agent[J]. The Surface Finishing Society of Japan, 1991, 42(7): 729-735.
[8]Mishra K G, Paramguru R K. Kinetics and mechanism of electroless copper deposition at moderate-to-high copper ion and low-to-moderate formaldehyde concentrations[J]. Metallurgical and Materials Transactions B, 1999, 30(2): 223-229.
[9]Mishra K G, Paramguru R K. Kinetics and mechanism of electroless deposition of copper[J]. Journal of the Electrochemical Society, 1996, 143(2): 510-516.
[10]Li J, Kohl P A. The acceleration of non formaldehyde electroless copper plating[J]. Journal of the Electrochemical Society, 2002, 149(12): C631-C636.
[11]Bindra P, Roldan J. Mechanisms of electroless metal plating. III. Mixed potential theory and the interdependence of partial reactions[J]. Journal of Applied Electrochemistry, 1987, 17(6): 1254-1266.
[12]Abrantes L M, Correia J P. On the mechanism of electroless Ni-P plating[J]. Journal of the Electrochemical Society, 1994, 141(9): 2356-2360.
[13]Haruyama S, Yoshizawa A, Ohno I. Estimation of the rate of electroless cobalt plating by electrochemical method[J]. Journal of the Metal Finishing Society of Japan, 1979, 30(6): 289-293.
[14]Barker B D, Taberner D. Electrochemical aspects of the electroless deposition of cobalt[J]. Surface Technology, 1981, 12(1):103-104.
[15]Ohno I, Haruyama S. Measurement of the instantaneous rate of electroless plating by an electrochemical method[J]. Surface Technology, 1981, 13(1): 1-15.
[16]Conway B E, White R E. Modern aspects of electrochemistry (vol. 35)[M]. New York: Kluwer Academic Publishers, 2002: Chapter 2.
[17]Yang F Z(杨防祖), Yang B(杨斌), Lu B B(陆彬彬), et al. Electrochemical study on electroless copper plating using sodium hypophosphite as reductant[J]. Acta Physico-Chimica Sinica(物理化学学报), 2006, 22(11): 1317-1320.
[18]Abyaneh M Y, Sterritt A, Mason T J. Effects of ultrasonic irradiation on the kinetics of formation, structure, and hardness of electroless nickel deposits[J]. Journal of the Electrochemical Society, 2007, 154(9): D467-D472.
[19]Malecki A, Micek-Ilnicka A. Electroless nickel plating from acid bath[J]. Surface and Coatings Technology, 2000, 123(1): 72-77.
[20]Xie Z H, Yu G, Li T J, et al. Dynamic behavior of electroless nickel plating reaction on magnesium alloys[J]. Journal of Coatings Technology and Research, 2012, 9(1): 107-114.
[21]Huang G F, Huang W Q, Wang L L, et al. Electrochemical study of electroless deposition of Fe-P alloys[J]. Electrochimica Acta, 2006, 51(21): 4471-4476.
[22]Gui L F(桂立丰). Handbook of materials testing for mechanical engineering: Corrosion and friction[M]. Liaoning: Liaoning Science and Technology Press(辽宁科学技术出版社), 2002, Chapter 1.
[23]Gorker L, Dimitrov V. Modified tafel equation for electroless metal deposition[J]. Progress in Reaction Kinetics and Mechanism, 2009, 34(2): 127-140.
[24]Gamburg Y D, Zangari G. Theory and practice of metal electrodeposition[M]. New York: Springer, 2011: Chapter 3.
[25]Kanani N. Electroplating: Basic principles, processes and practice[M]. Oxford UK: Elsevier, 2004: Chapter 4.

酸性化学镀镍磷合金的动力学机理

Kinetics and Mechanism of Acidic Electroless Ni-P Plating

PDF (PC)

可视化

被引次数

摘要/Abstract

引用本文

使用本文

参考文献

相关文章 15

Metrics

[1]	沈钰, 李冰冰, 马艺, 王增林. 化学镀钴和超级化学镀填充的研究进展[J]. 电化学（中英文）, 2022, 28(7): 2213002-.
[2]	王赵云, 金磊, 杨家强, 李威青, 詹东平, 杨防祖, 孙世刚. 高密度互连印制电路板孔金属化研究和进展[J]. 电化学（中英文）, 2021, 27(3): 316-331.
[3]	韩平, 冯海涛, 董亚萍, 田森, 张波, 李武. 氢氧化钠水溶液体系中金属铬的电化学氧化过程[J]. 电化学（中英文）, 2020, 26(3): 413-421.
[4]	邓俊豪, 王贵, 胡杰珍, 邓培昌, 胡欢欢. 基于电化学噪声研究模拟海洋大气环境下304不锈钢的点蚀行为[J]. 电化学（中英文）, 2020, 26(2): 298-307.
[5]	饶妍，李赏，周芬，田甜，钟青，宛朝辉，谭金婷，潘牧. 低铂膜电极结构优化途径[J]. 电化学（中英文）, 2018, 24(6): 677-686.
[6]	秦建新，林峰，刘文平，陈超，任孟德. 酸性溶液中Fe²⁺ /Fe³⁺相互转换对电极还原行为的影响[J]. 电化学（中英文）, 2017, 23(6): 702-707.
[7]	李鹏，赵跃民，王立章*，张延乐，芦兆青. β-PbO₂/Sb-SnO₂/Ti电极的苯酚电催化性能研究[J]. 电化学（中英文）, 2014, 20(5): 493-498.
[8]	李扬，黄波*，袁梦，张志秋，刘宗尧，唐旭晨，朱新坚. 中温固体氧化物燃料电池LaNi_0.6Fe_0.4O_3-δ-Gd_0.2Ce_0.8O₂梯度复合阴极制备及交流阻抗性能[J]. 电化学（中英文）, 2014, 20(1): 45-50.
[9]	张恩仁, 牛俊乐, 刘雷, 刁国旺. 微生物阳极燃料电池极性反转现象研究[J]. 电化学（中英文）, 2013, 19(4): 376-382.
[10]	任睿轩, 黄波, 朱新坚, 胡一星, 丁小益, 刘宗尧, 刘烨彬. Gd_0.2Ce_0.8O₂包覆LaNi_0.6Fe_0.4O_3-δ阴极制备及性能[J]. 电化学（中英文）, 2013, 19(3): 275-280.
[11]	王博莲, 赵亚萍, 蔡再生. 锦纶织物表面无Sn²⁺离子敏化活化法化学镀银工艺优化[J]. 电化学（中英文）, 2013, 19(3): 281-288.
[12]	胡光辉, 曾海霞, 魏志钢, 潘湛昌, 谢署光, 邹燕娣. Ni-P-TiO2化学复合镀层电极的乙醇电催化氧化[J]. 电化学（中英文）, 2012, 18(2): 186-190.
[13]	孟云, 赵亚萍, 蔡再生. 锦纶织物无钯活化化学镀银工艺及性能研究[J]. 电化学（中英文）, 2011, 17(4): 380-387.
[14]	马厚义, 崔聪颖, 陈婷. 金属腐蚀与防护简谈[J]. 电化学（中英文）, 2011, 17(3): 288-291.
[15]	李莉莉, 王炜. 巯基改性棉纤维化学镀银导电布的研究[J]. 电化学（中英文）, 2011, 17(2): 222-226.