[1]Yeh S H,Wan C C.A study of SiC-Ni composite plat-ing in the Watts bath[J].Plating and Surface Finish-ing,1997,84(3):54.
[2]Sandra W Watson.Electrochemical study of SiC particleocclusion during nickel electrodeposition[J].J Electro-chem Soc,1993,140(8):2235-2238.
[3]Benea L,Bonora P L,Borello A,et al.Preparation andinvestigation of nanostructured SiC-nickle layers byElectrodeposition[J].Solid State Ionics,2002,151:89-95.
[4]TU Wei-yi(涂伟毅),XU Bin-shi(徐滨士),DONGShi-yun(董世远),et al.Effect of n-Al2O3on electro-chemical nucleation and chemical binding interaction innickel electro-deposition[J].Trans Nonferrous Met SocChina,2005,15(4):889-896.
[5]ZHAO Xu-shan(赵旭山),TAN Cheng-yu(谭澄宇),CHEN Wen-jing(陈文敬),et al.Nucleation kineticsanalysis of Ni-SiC composite film during early electro-crystallization processes[J].The Chinese Journal ofNonferrous Metals,2008,18(5):823-828.
[6]Fleischmann M,Thirsk HR.Potentiostatic study on thegrowth of deposits on electrodes[J].Electrochimica Ac-ta,1959,1:146-160.
[7]Greef R,Peat R,Peter L M,et al.Instrumental meth-ods in electrochemistry[M].Chichester:Ellis Hor-wood,1985.304-309.
[8]Benea L.Composite electrodeposition-theory and prac-tice[M].Editor:Porto Franco.Romania,1998.
[9]Gomez E,Muller C,Proud W G,et al.Electrodeposi-tion of nickel on vitreous carbon:influence of potentialon deposit morphology[J].Journal of Applied Electro-chemistry,1992,22:872-876.
[10]Epelboin I,Joussellin M,Wiart R.Impedance meas-urements for nickel deposition in sulfate and chloride e-lectrolytes[J].J Electroanal Chem,1981,119(1):61-67.
[11]RENJun(任俊),SHENJian(沈健),LUShou-ci(卢寿慈).Particle dispersed science&technique[M].Beijing:Chemical Industry Press,2005.
[12]GUO He-tong(郭鹤桐),ZHANG San-yuan(张三元).Composite plating technique[M].Beijing:Chemical Industry Press,2007,58.
[13]Hu F,Chan K C.Deposition behaviour and morpholo-gy of Ni-SiC electro-composites under triangular wave-form[J].Applied Surface Science,2005,(243):251-258.
[14]Nowak P,Socha R P,Kaisheva M,et al.Electro-chemical investigation of the codeposition of SiC andSiO2particles with nickel[J].Journal of Applied E-lectrochemistry,2000,30:429-437. |