铜互连电镀中有机添加剂的合成与分析
翟悦晖, 彭逸霄, 洪延, 陈苑明, 周国云, 何为, 王朋举, 陈先明, 王翀
Synthesis and Evaluation of Organic Additives for Copper Electroplating of Interconnects
Yue-Hui Zhai, Yi-Xiao Peng, Yan Hong, Yuan-Ming Chen, Guo-Yun Zhou, Wei He, Peng-Ju Wang, Xian-Ming Chen, Chong Wang
电化学（中英文）
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2023, (8): 2208111
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DOI: 10.13208/j.electrochem.2208111
