应用于大马士革工艺的纳米孪晶铜脉冲电沉积研究
王玉玺, 高丽茵, 万永强, 李哲, 刘志权
Pulse Electroplating of Nanotwinned Copper Using MPS-PEG Two-Additive System for Damascene via Filling Process
Yu-Xi Wang, Li-Yin Gao, Yong-Qiang Wan, Zhe Li, Zhi-Quan Liu
电化学（中英文）
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2023, (8): 2209231
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DOI: 10.13208/j.electrochem.2209231
