电沉积铜箔的微观组织结构——三维电结晶模式中的电结晶机理探讨
刘仁志, 谢平令, 王翀
Microstructure of Electrodeposited Copper Foil: Discussion on the Mechanism Model of Three-Dimensional Electrocrystallization
Ren-Zhi Liu, Ping-Ling Xie, Chong Wang
电化学（中英文）
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2022, (6): 2104481
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DOI: 10.13208/j.electrochem.210448
