酸性镀铜添加剂开发及应用技术
邹浩斌, 谭超力, 熊伟, 席道林, 刘彬云
Introduction of Development and Application Technology of Organic Additives for Acid Copper Electroplating
Hao-Bin Zou, Chao-Li Tan, Wei Xiong, Dao-Lin Xi, Bin-Yun Liu
电化学（中英文）
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2022, (6): 2104531
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DOI: 10.13208/j.electrochem.210453
