玻璃通孔三维互连镀铜填充技术发展现状
纪执敬, 凌惠琴, 吴培林, 余瑞益, 于大全, 李明
Development Status of Copper Electroplating Filling Technology in Through Glass Via for 3D Interconnections
Zhi-Jing Ji, Hui-Qin Ling, Pei-Lin Wu, Rui-Yi Yu, Da-Quan Yu, Ming Li
电化学（中英文）
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2022, (6): 2104461
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DOI: 10.13208/j.electrochem.210446
