应用正交试验法研究巯基改性棉纤维表面化学镀银的特性，测定各因素对表面方阻和增重率的影响，得出制备化学镀银棉织物的最佳工艺：巯基硅烷浓度1%、改性时间120 min、改性液浴比1:60、硝酸银用量3.5 g、葡萄糖用量45 g、化学镀温度50 ℃、化学镀时间60 min.SEM和XRD分析表明巯基改性棉织物镀层均匀致密，具有良好的电磁屏蔽性.采用透明胶带法测试证实，该镀层结合牢固.
This paper studies on the characteristics of the electroless silver plating cotton fiber modi?ed with 3-mercaptopropyltriethoxysilane.The effects of each factors on surface resistance and rate of weight gain was tested by the method of orthogonal test. It is concluded that the optimal technology for preparing the silver plating cotton fiber:concentration of the 3-mercaptopropyltriethoxysilane 1%, modification time 120min, the bath ratio of modification 1:60,dosage of AgNO3 3.5g, dosage of C6H12O6 3.5g, plating temperature 50℃, plating time 60min. SEM and XRD analysis shows that the silver plating on the cotton fiber modified with mercapto is uniform and density. This fiber has good electromagnetic shielding. The silver coating has excellent adhesion fastness tested by the scotch tape test.
[1] ZHANG Bi-tian(张碧田), LI Guo-xun(李国勋), ZHAI Jun-ying(翟俊瑛). Preparation and Application of Electromagnetic Shielding Fabrics[J].Environmental Engineering,1995, 13(5):38-
39,29.
[2] SHAO Ming(邵明),ZHAO Min(赵敏),ZHOU Xiang(周翔). Antibacterial finishing of cotton fabric with nano-sized silver colloidal solution[J]. Dyeing and Finishing, 2006,32(10):1-4.
[3] Guo R H, Jiang S Q, Yuen C W M, et al. An alternative process for electroless copper plating on polyester fabric[J].J Mater Sci: Mater Electron,2009,20:33-38.
[4] PAN Zhi-yong(潘智勇), ZHANG Hui(张慧), WU Zhong-Wei(吴中伟). Advances of Studies on Electromagnetism Shielding Fabric[J]. Science & Technology Review, 2009,27(24):86-91.
[5]GAN Xue-ping(甘雪萍),WU Ya-ting(仵亚婷),HU Wen-bin(胡文彬),et al. Study on Properties of Conductive PET Fabrics Prepared by Electroless Copper and Nickel Plating[J]. Journal of Materials Engineering, 2007,(8):13-16.
[6] Liu P, Liu W M, Xue Q J. In situ radical transfer addition polymerization of styrene from silica nanoparticles[J]. European Polymer Journal, 2004, 40: 267.
[7] JIANG Xiao-xia(姜晓霞),SHEN Wei-ji(沈伟基). The Fundamental and Practice of Electroless Plating[M],1st ed. Beijing: Defense and Industry Publishing House,2000:361.
[8] Keiser B. Principles of electromagnetic compatibility[M]. Dedham: Artech House,1979.
[9] DONG Guang-tian(董光天). 1000 Questions about Measurement and Control for EMI [M].1st ed(第一版).Beijing: Electronic Industry Press, 2003.
