亚硫酸盐无氰电沉积金新工艺及机制
Electrodeposition Mechanism and Process of a Novel Cyanide-Free Gold Sulfite Bath
Received date: 2022-01-07
Revised date: 2022-03-01
Online published: 2022-03-17
杨家强 , 金磊 , 李威青 , 王赵云 , 杨防祖 , 詹东平 , 田中群 . 亚硫酸盐无氰电沉积金新工艺及机制[J]. 电化学, 2022 , 28(7) : 2213005 . DOI: 10.13208/j.electrochem.2213005
A novel cyanide-free gold sulfite process is introduced in this paper. In the bath, chloauric acid was directly employed as the main salt, and hydroxyethylidene diphosphonic acid (HEDP) was used as the stabilizer and coating grain refiner. The bath stability, the gold coating morphology and the mechanism of gold electrodeposition were studied in detail. The results showed that HEDP could significantly improve the bath stability. Moreover, the grains of the gold coating obtained from the gold sulfite bath without HEDP was rod-like, which grew gradually with the increasing of the deposition time, resulting in that the appearance of the coating turned from a golden yellow to a hazy reddish brown by the increase of the coating thickness. As HEDP was introduced into the gold sulfite bath, the gold grains were transformed to pyramidal, and the grain growth rate accompanying the increase of the coating thickness was much slower than that in the gold sulfite bath without HEDP, observing the golden bright appearance within 1 μm thickness. Electrochemical curves indicated that gold electrodeposition did not undergo a nucleation stage.
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