锦纶织物表面无Sn2+离子敏化活化法化学镀银工艺优化

doi:10.61558/2993-074X.2961

电化学（中英文） ›› 2013, Vol. 19 ›› Issue (3): 281-288. doi: 10.61558/2993-074X.2961

锦纶织物表面无Sn²⁺离子敏化活化法化学镀银工艺优化

王博莲，赵亚萍^*，蔡再生^*?

东华大学生态纺织教育部重点实验室，上海 201620

收稿日期:2012-06-11 修回日期:2012-07-27 发布日期:2012-08-02 出版日期:2013-06-28
基金资助:
上海市自然科学基金项目(No. 12ZR1400400)和中央高校基本科研业务费专项(生态纺织教育部重点实验室基地培育项目，No. 12D10534)资助

Optimization of Electroless Silver Plating Process on Fabric Surface without Activation and Sensitization

WANG Bo Lian, ZHAO Ya ping^*, CAI Zai Sheng^*

Key Laboratory of Science & Technology of Eco-Textile , Ministry of Education, Donghua University, Shanghai 201620, China

Received:2012-06-11 Revised:2012-07-27 Online:2012-08-02 Published:2013-06-28

摘要/Abstract

摘要： 采用交联壳聚糖预处理锦纶织物后化学镀银，通过正交试验确定了化学镀银的工艺条件：硝酸银14 g·L^-1，氢氧化钠6 g·L^-1，氨水130 mL·L^-1，时间50 min. 采用扫描电子显微镜与能量分散谱仪（SEM-EDS），X-射线衍射（XRD）观察，表征和评价织物镀层的表观形貌、结构组成和摩擦性能. 结果表明，织物表面无敏化化学镀银层的晶粒细致、分布均匀，尺寸为28.9 nm，(111）面择优取向较明显，耐摩擦性能好.

关键词:

无敏化活化, 化学镀银, 锦纶织物, 正交试验, 壳聚糖

Abstract: Silver was deposited homogeneously on the surface of polyamide fabric by electroless plating without activation and sensitization. The electroless silver plating process was optimized with the orthogonal array testing strategy. It is found that the optimum conditions are the electroless plating time of 50 min with the concentrations of silver nitrate, sodium hydroxide and ammonium hydroxide being 14 g·L^-1, 6 g·L-1 and 130 mL·L^-1, respectively. The surface morphologies, compositions, and phases of fabric samples were characterized by scanning electron microscopy and energy-dispersive X-ray spectrometry (SEM-EDS), X-ray diffraction (XRD). The wear-resisting property was tested by friction fastness test machine. The results show that the gain size of silver plating layer is 28.9 nm with the preferred orientation along direction (111) and the good wear resistance.

Key words:

without activation and sensitization, electroless silver, nylon fabric, orthogonal test, chitosan

中图分类号:

TS195.5

王博莲, 赵亚萍, 蔡再生. 锦纶织物表面无Sn²⁺离子敏化活化法化学镀银工艺优化[J]. 电化学（中英文）, 2013, 19(3): 281-288.

WANG Bo-Lian, ZHAO Ya-Ping, CAI Zai-Sheng. Optimization of Electroless Silver Plating Process on Fabric Surface without Activation and Sensitization[J]. Journal of Electrochemistry, 2013, 19(3): 281-288.

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https://electrochem.xmu.edu.cn/CN/Y2013/V19/I3/281

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锦纶织物表面无Sn²⁺离子敏化活化法化学镀银工艺优化

Optimization of Electroless Silver Plating Process on Fabric Surface without Activation and Sensitization

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