“电子电镀专辑”序言

doi:10.13208/j.electrochem.210440

电化学（中英文） ›› 2022, Vol. 28 ›› Issue (6): 2104401. doi: 10.13208/j.electrochem.210440

• 电子电镀专辑（李明教授、陈智栋教授、何为教授、王翀副教授主编） • 上一篇下一篇

“电子电镀专辑”序言

陈智栋¹, 王翀², 何为², 李明³^,^*()

收稿日期:2022-06-02 修回日期:2022-06-25 出版日期:2022-06-28 发布日期:2022-07-26
通讯作者: 李明 E-mail:mingli90@sjtu.edu.cn

Preface to Special Issue on Electronic Electroplating

Zhi-Dong Chen¹, Chong Wang², Wei He², Ming Li³^,^*()

1. School of petrochemical engineering, Changzhou University, Changzhou 213164, Jiangsu, China
2. School of Materials and Energy, University of Electronic Science and Technology of China
3. School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai, 200240, China

Received:2022-06-02 Revised:2022-06-25 Published:2022-06-28 Online:2022-07-26
Contact: Ming Li E-mail:mingli90@sjtu.edu.cn

摘要/Abstract

陈智栋, 王翀, 何为, 李明. “电子电镀专辑”序言[J]. 电化学（中英文）, 2022, 28(6): 2104401.

Zhi-Dong Chen, Chong Wang, Wei He, Ming Li. Preface to Special Issue on Electronic Electroplating[J]. Journal of Electrochemistry, 2022, 28(6): 2104401.

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“电子电镀专辑”序言

Preface to Special Issue on Electronic Electroplating

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