高深径比通孔脉冲电镀添加剂及电镀参数的优化
杨凯, 陈际达, 陈世金, 许伟廉, 郭茂桂, 廖金超, 吴熷坤
Optimization of Pulse Plating Additives and Plating Parameters for High Aspect Ratio Through Holes
Kai Yang, Ji-Da Chen, Shi-Jin Chen, Wei-Lian Xu, Mao-Gui Guo, Jin-Chao Liao, Zeng-Kun Wu
电化学（中英文）
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2022, (6): 2104491
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DOI: 10.13208/j.electrochem.210449
