关键词: 焦磷酸盐镀铜, 临界起始电流密度, 结合强度, XPS, 深度刻蚀

Abstract: The relationship between the type of on changes of copper electroplating potential~time and the adhesion of coating layer was examined by chronopotentiometry. The conception of critical initial current density (D_(KC)) was put forward. When the initial working current (D_(KI)) was higher than the critical initial current, the iron electrodewas polarized to activation potential of iron surface firstly, then to the activation of the substratesurface, and finally to depositionpotentialof copper ion. The coating deposited on the active surface and had goodadhesion.On the contrary,when D_(KI) was lower than D_(KC), the coating deposits on the surface of "passivated" iron substrate, and bad coating was only gained. The combinationof Ar ion sputtering and X radial photoelectron spectra may measure the existence ofoxygen layerbetween copper coating and iron substrate. Through adjusting technical condition, the optimal process of pyrophosphatedirection copper plating was given.

Key words: Pyrophosphate copper plating, Critical initial current density, Adhesion, X radial photoelectron spectra, Depth etching