络合剂和添加剂对化学镀铜影响的电化学研究
谷新, 王周成, 林昌健
An Electrochemical Study of the Effects of Chelating Agents and Additives on Electroless Copper Plating
GU Xin, WANG Zhou-Cheng, LIN Chang-Jian~ . and Eng., Xiamen Univ., 361005, China)
电化学（中英文）
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2004, (1): 14
-19
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DOI: 10.61558/2993-074X.1539
