欢迎访问《电化学(中英文)》期刊官方网站,今天是
络合剂和添加剂对化学镀铜影响的电化学研究
谷新,王周成,林昌健
An Electrochemical Study of the Effects of Chelating Agents and Additives on Electroless Copper Plating
GU Xin, WANG Zhou-Cheng, LIN Chang-Jian~* . and Eng., Xiamen Univ., 361005, China)
电化学(中英文) . 2004, (1): 14 -19 .