2,2′-联吡啶和亚铁氰化钾对乙醛酸化学镀铜的影响
申丹丹, 杨防祖, 吴辉煌,
Effect of 2,2′-dipyridyl and K_4Fe(CN)_6 on Electroless Copper Plating Using Glyoxylic Acid as Reducing Agent
SHEN Dan-dan, YANG Fang-zu, WU Hui-huang
电化学（中英文）
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2007, (1): 67
-71
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DOI: 10.61558/2993-074X.1782
