三苯甲烷类染料整平剂用于再布线层高速电镀铜的形貌调控机制研究
宋子豪, 王伟斌, 柳晓辉, 韩晓敏, 周毅, 黄蕊, 姜艳霞, 李哲, 刘晓伟, 肖梅玲, 廖洪钢, 徐维林, 孙蓉
Triphenylmethane-Derived Levelers for High-Speed Redistribution Layer Copper Electroplating of Tailored Surface Morphologies
Zihao Song, Weibin Wang, Xiaohui Liu, Xiaomin Han, Yi Zhou, Rui Huang, Yanxia Jiang, Zhe Li, Xiaowei Liu, Meiling Xiao, Hong-Gang Liao, Weilin Xu, Rong Sun
电化学（中英文）
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DOI: 10.61558/2993-074X.3591
