Sn-Ag-Cu三元合金焊料电沉积中添加剂的影响研究
缪桦, 李明瑞, 邹文中, 周国云, 王守绪, 叶晓菁, 朱凯
Study on the Effect of Additives in the Electrodeposition of Sn-Ag-Cu Ternary Alloy Solder
Hua Miao, Ming-Rui Li, Wen-Zhong Zou, Guo-Yun Zhou, Shou-Xu Wang, Xiao-Jing Ye, Kai Zhu
电化学（中英文）
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2022, (6): 2104411
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DOI: 10.13208/j.electrochem.210441
