印制电路中电镀铜技术研究及应用
王翀, 彭川, 向静, 陈苑明, 何为, 苏新虹, 罗毓瑶
Research and Application of Copper Electroplating in Interconnection of Printed Circuit Board
Chong Wang, Chuan Peng, Jing Xiang, Yuan-Ming Chen, Wei He, Xin-Hong Su, Yu-Yao Luo
电化学（中英文）
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2021, (3): 257
-268
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DOI: 10.13208/j.electrochem.201255
