高密度互连印制电路板孔金属化研究和进展
王赵云, 金磊, 杨家强, 李威青, 詹东平, 杨防祖, 孙世刚
Studies and Progresses on Hole Metallization in High-Density Interconnected Printed Circuit Boards
Zhao-Yun Wang, Lei Jin, Jia-Qiang Yang, Wei-Qing Li, Dong-Ping Zhan, Fang-Zu Yang, Shi-Gang Sun
电化学（中英文）
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2021, (3): 316
-331
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DOI: 10.13208/j.electrochem.201119
