在组成为:0.22mol/L硫酸镍、0.06mol/L钼酸钠和0.3mol/L柠檬酸钠的溶液,于纯铜片上采用恒电流沉积,所得Ni-Mo合金沉积层经X射线衍射测定,结果表明在温度为25℃~50℃,电流密度为10mA·cm-2~30mA·cm-2范围,Ni-Mo合金沉积层表现为(111)择优取向.循环伏安和电位阶跃实验表明镍钼合金电结晶过程按照连续成核和三维生长方式进行.Ni-Mo合金电沉积过程的电化学交流阻抗谱表明Ni-Mo共沉积过程经历了吸附中间产物步骤,由于吸附态物种氢氧化镍和钼的氧化物将阻化晶粒(111)晶面的生长,从而使镍钼沉积层表现为(111)择优取向.
Ni Mo alloy deposits with (111) preferred orientation was obtained in a solution of 0.22 mol/L NiSO 4·6H 2O, 0.06 mol/L Na 2MoO 4·2H 2O and 0.3 mol/L Na 3C 6H 5O 7·2H 2O in temperature from 25℃ to 50℃,and current densities ranged from 10 mA·cm -2 to 30 mA·cm -2 . The electrodeposition of Ni Mo alloy was studied by cylic voltammetry and potential step experiment. It was shown that Ni Mo alloy is formed by mechanism involving progressive nucleation followed by three dimensional growth of the metal centres. The complex plane impedance plots indicate codeposition of Ni Mo alloy involves the intermediate adion. The growth of (111) plane of crystallite is inhibited with adsorption of (NiOH) ads and MoO 2, So Ni Mo alloy deposit exhibits (111) preferred orientation.
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