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研究论文

铜在储氢合金表面包铜电极中的行为

  • 张大为
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  • 南开大学新能源材料化学研究所

收稿日期: 1997-08-28

  修回日期: 1997-08-28

  网络出版日期: 1997-08-28

Behavior of Copper in Hydrogen Storage Alloy Microencapsulated by Copper

  • Zhang Dawei Yuan Huatang Yang Huabin Zhou Zuoxiang Zhang Yunshi
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  • (Inst. of New Energy Material Chem., Nankai Univ., Tianjin 300071

Received date: 1997-08-28

  Revised date: 1997-08-28

  Online published: 1997-08-28

摘要

在密封的电池体系中(即贫液状态),包铜储氢合金电极具有较好的抗氧化能力;而在强碱性溶液中(即富液状态),铜在电极工作的电位范围内(-1.1~-0.4V)具有一定的稳定性,但当扩展扫描范围(-1.1~-0.2V),将出现铜的氧化还原反应.随着充放电循环的进行,铜被氧化成Cu2O,进而形成CuO2-2进入电解质(KOH)溶液中,充电时又以Cu的形式于电极表面析出.针对这一现象,本文利用电位阶跃实验研究了CuO2-2离子在镍电极上的电沉积过程,结果表明该过程遵循二维瞬时成核机理

本文引用格式

张大为 . 铜在储氢合金表面包铜电极中的行为[J]. 电化学, 1997 , 3(3) : 263 -270 . DOI: 10.61558/2993-074X.3123

Abstract

Negative electrode made from Cu microencapsulated hydrogen storage alloy was studied by using cyclic voltammetry method. The results showed that copper as a coating material was of a certain stability in 5 mol/L KOH solution within the range of charge and discharge voltage. But when expanding the sweep voltage, the CV curve showed a pair of distinct oxidation reduction current peaks of Cu 2O formation at E =-0.3 V and Cu 2O reduction at E =-0.6 V. With charging discharging cycles, copper is liable to be oxidized to Cu 2O and further oxidized into CuO 2- 2. When charged again, CuO 2- 2 anion is reduced and Cu is electrodeposited on the sufrace of electroce. In respond to this phenomenon, the electrodeposition process of CuO 2- 2 on the smooth Ni electrode was studied by constant potential step technique. The results showed that the deposition process of copper followed the two dimension instantaneous mechanism.

参考文献

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