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研究论文

缓冲剂对镀镍过程作用机理的研究

  • 高灿柱 ,
  • 鹿玉理
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  • 山东大学环境工程系,中国科学院兰州化学物理研究所

收稿日期: 1998-05-28

  修回日期: 1998-05-28

  网络出版日期: 1998-05-28

Influence of Buffers on the Blectrodeposition of Nickel from a Watts Bath

  • Gao Canzhu Lu Yuli ,
  • Liu Rutao Chen Fang
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  • (Dep.of Env.Eng.Shandong Univ.Jinan,Shandong 25000)Li Shuben(Lanzhou Inst. of Chem. Phy. Chinese Acad. of Sci.Lanzhou,Gansu,730000)

Received date: 1998-05-28

  Revised date: 1998-05-28

  Online published: 1998-05-28

摘要

缓冲剂对镀镍过程作用机理的研究①高灿柱鹿玉理刘汝涛陈方(山东大学环境工程系济南250100)李树本(中国科学院兰州化学物理研究所兰州730000)电镀镍是量大面广的镀种,它作为镀铬、贵金属、仿金、枪黑、黑镍的底层,用途非常广泛[1].在镀镍过程中,...

本文引用格式

高灿柱 , 鹿玉理 . 缓冲剂对镀镍过程作用机理的研究[J]. 电化学, 1998 , 4(2) : 223 -227 . DOI: 10.61558/2993-074X.2697

Abstract

The electrochemical reactions occurring during the deposition of nickel from Watts bath have been examined using the voltammetric technique. The important reactions taking place at the anode and cathode have been identified. The influence of buffers HAc,H_3BO_3 and NH_4Cl on the rate of nickel deposition was marked in the lower concentration (0.01-0.05 mol/L) of buffers. The reason why buffers make the rate of nickel deposition increase were discussed.

参考文献

1邝少林.性能优异的典型镀种添加剂的研究开发不容忽视.电镀与精饰,1995;17(4):32TilakBV,GendronAS,MosoiuMA.Boratebuferequilibriainnickelrefiningelectrolytes.J.Appl.electrochem.1997,7:4953JamesPHoare.Boricacidasacatalystinnickelplatingsolutions.J.Electrochem.Sco.,1987,134F(12):3102~31034JohnO’M.BockrisandshahedU.M.Khan.SurfaceelectrochemistryaMolecularlevelAproach.NewYorkandLondon:PlenumPres;1994:25MimaneT,MayannaSM,MunichandraiahN.Influenceofadditivesoftheelectrodepositionofnickelfromawatsbath:acyclicvoltammetricstudy.J.Appl.Electrochem.,1993,23:339~3456FleischmannMandSaraby—ReintjesA.Thesimultaneousdepositionofnickelandhydrogenonvitreouscarbon.ElectrochimicaActa.1984,29(1):69~757HoareJP,HowieBJ,andLabodaMA.Astudyofhigh-spedplatingofnickel.Plat.Surf.Finish,1986,73(Sept):62
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