酸性镀铜体系的交流阻抗研究
Studies on Impedance of Acid-copper Electroplating System
(Chemical Engineering Dept. of Xiangtan Polytechnical University, Hunan 411201)
(Applied Chemistry Dept. of Tianjin University, Tianjin 300072)
Received date: 1998-05-28
Revised date: 1998-05-28
Online published: 1998-05-28
邓文 . 酸性镀铜体系的交流阻抗研究[J]. 电化学, 1998 , 4(2) : 152 -158 . DOI: 10.61558/2993-074X.1358
/
| 〈 |
|
〉 |
