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研究论文

细菌修饰的碳糊电极表面超细微粒金膜的制备及应用

  • 胡荣宗
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  • 厦门大学化学系,固体表面物理化学国家重点实验室,国家教委材料和生命过程分析开放研究实验室

收稿日期: 1999-05-28

  修回日期: 1999-05-28

  网络出版日期: 1999-05-28

Preparation and Application of Gold_Film on the Surface of Bacterial_Modified Carbon Paste Electrode

  • Hu RongzongRuan YanpingXu HaoFu JinkunZhang WeideHu Wenyun
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  • (Dept. of Chem., State Key Lab. for Phys. Chem. of Solid Surf., Res. Labo. of SEDC of Anal. Sci. for Materials and Life Chem., Xiamen Univ., Xiamen 361005

Received date: 1999-05-28

  Revised date: 1999-05-28

  Online published: 1999-05-28

摘要

本文提出一种采用电化学方法在巨大芽孢杆菌D01修饰的碳糊电极表面制备超细微粒金膜的新方法,获得由平均粒径为80nm金微粒组成的金膜.该方法操作简单,耗金量少,以此金膜作为工作电极检测水溶液中痕量铜具有良好的重现性和线性,检测灵敏度达0.02ng/mL.该电极既可象金片电极多次反复被使用,也可以象碳糊电极一样不断更新表面

本文引用格式

胡荣宗 . 细菌修饰的碳糊电极表面超细微粒金膜的制备及应用[J]. 电化学, 1999 , 5(2) : 231 -235 . DOI: 10.61558/2993-074X.3181

Abstract

A novel method for preparation of gold_film composed of ultra_fine gold particles was reported in this paper. The gold_film was prepared by electrochemical method on the surface of the paste electrode modified with the strain Bacillus sp. D01 which has strong ability to absorb and reduce Au3+. In addition, this paper reported an experimental method of determining trace amount of Cu2+ in water solution using cathodic stripping analysis to estimate the performances of the obtained gold_film. The experimental results indicated that this new method for preparation of gold_film is simple. The obtained gold_film electrode is stable and sensitive to determining Cu2+.

参考文献

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