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研究论文

硫脲及其衍生物对铜阴极电沉积影响的电化学研究

  • 董云会
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  • 淄博学院材料系!淄博255200,淄博学院材料系!淄博255200,淄博学院材料系!淄博255200

收稿日期: 1999-08-28

  修回日期: 1999-08-28

  网络出版日期: 1999-08-28

Influence of Thiourea and Its Derivate on the Process of Cathodic Electrodeposition of Copper

  • Dong Yunhui Zou Aihong ZHao Yunxia
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  • (Dept. of Materials, Zibo College, Zibo 255200

Received date: 1999-08-28

  Revised date: 1999-08-28

  Online published: 1999-08-28

本文引用格式

董云会 . 硫脲及其衍生物对铜阴极电沉积影响的电化学研究[J]. 电化学, 1999 , 5(3) : 342 -345 . DOI: 10.61558/2993-074X.3195

Abstract

The effects of thiourea and its derivate on the electrodeposition of copper from the dilute acid sulphate solutions have been studied by using potential sweep techniques at quasisteady state. Limiting current densities( I d),exchange current densities( i 0) and αn are obtained by data processing with the least square method.Thiourea has a depolarizing effect on the copper depositing at concentrations below 8 mg·L -1 ,and a polarizing effect at higher concentration (>10 mg·L -1 ),and it changes the mechanism of copper deposition reaction.Propenyltiourea and Phenylthiourea have a depolarizing effect on the copper depositing,but the mechanism of copper deposition reaction is not changed.XRD results indicate with increasing thiourea concentration the predominant oriedthation of copper deposition from (220) to (111).

参考文献

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