镍钨硼合金电沉积机理及镀层微晶尺寸
收稿日期: 2000-05-28
修回日期: 2000-05-28
网络出版日期: 2000-05-28
Electrocrystallization Mechanism and Grain Sizes of Ni-W-B Alloy Eletrodeposits
Received date: 2000-05-28
Revised date: 2000-05-28
Online published: 2000-05-28
杨防祖 , 曹刚敏 , 胡筱 , 许书楷 , 周绍民 . 镍钨硼合金电沉积机理及镀层微晶尺寸[J]. 电化学, 2000 , 6(2) : 169 -174 . DOI: 10.61558/2993-074X.1377
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