镓锡合金沉积于铝阳极表面 ,形成活化点 ,是铝阳极活化的根本原因 .简单的Al_Sn、Al_Ga二元合金在碱性介质中不能活化 .Al_Sn_Ga多元合金阳极溶解时 ,Ga、Sn溶解进入溶液 .锡离子首先还原沉积于铝阳极表面 ,镓离子又在沉积的锡上沉积 ,在铝合金阳极表面不断形成Ga_Sn合金活性点 .低溶点的合金由于其良好的流动性 ,以单个或多个原子的形式嵌入氧化膜 ,形成活性点 ,起到了局部分离氧化膜的作用 ,是铝合金阳极活化的关键
李振亚
,
易玲
,
刘稚蕙
,
杨林
,
苏景新
,
陈艳英
. 含镓、锡的铝合金在碱性溶液中的活化机理[J]. 电化学, 2001
, 7(3)
: 316
-320
.
DOI: 10.61558/2993-074X.3261
The major reason for Al_anode's activation is that Ga and Sn deposit on the aluminum surface and form activated points. The Al_Sn and Al_Ga binary alloys can't be activated in alkaline medium. During the dissolution of the Al_Sn_Ga ternary anode, Sn and Ga dissolve into the solution and transform into ions. After the Sn ions deposit on the surface of Al_anode, the Ga ions will deposit on Sn. The higher activation of the polynary alloy anode is caused by much more new activated points composed of Ga_Sn alloy being continually formed. Ga_Sn alloy with low melting point deposited on the surface of Al can implant in the oxide film with single or multi_atoms because of their fluidity, and form active points which can separate oxide film locally. This is the key for activation of Al alloy.
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