运用循环伏安和计时安培法研究酸性镀铜溶液中硫酸和 2_巯基苯骈咪唑对铜电沉积初期行为的影响 .实验表明铜的电沉积经历了晶核形成过程 ,其电结晶按瞬时成核三维生长方式进行 ,硫酸对铜的电沉积具有加速作用 ,而 2_巯基苯骈咪唑对铜的电沉积起阻化作用 ,两者均不改变铜的电结晶机理
Initial stages of copper electrodeposition on glassy carbon electrode from acid sulphate solutions were studied using cyclic voltammetry and chronoamperometry.The electrolyte solution was a 0.05 mol.L -1 copper sulphate,1.4～1.8 mol.L -1 sulphuric acid containing 1 mg.L -1 2_mercaptobenzoimidazole,Results show that 2_mercaptobenzoimidazole produced an inhibition of the copper deposition,probably related to the adsorption,sulphuric acid promote copper electrodeposition.The initial deposition kinetics corresponded to a model including instantaneous nucleation and diffusion controlled growth.Addition of 2_mercaptobenzoimidazole and sulphuric acid did not change the initial nucleation of copper electrocrystallization,it increased the nucleation rate and the number density of nuclei at the surface.
[1] PliethW .Additivesintheelectrocrystallizationprocess[J].Electrochim.Acta,1992,37:2115.
[2] HealyJP ,PletcherD .TheChemistryoftheadditivesinanacidcopperelectroplatingbath[J].J.Electroanal,Chem.,1992,338:155.
[3] ReidJD ,DavidAP .Impedancebehaviorofasulfuricacid_cupricsulfate/coppercathodeinterface[J].J .Elec trochem.Soc.,1987,134:1389.
[4] KellyJJ ,WestAC .Copperdepositioninthepresenceofpolyethyleneglycol[J].J .Electrochem.Soc.,1998,145:3473.
[5] FletcherS .Somenewformulaeapplicabletoelectrochemicalnucleation/growthcollision[J].Electrochim.Acta,1983,28:917.
[6] FabricusG ,KontturiK ,SundholmG .Influenceofthioureaonthenucleationofcopperfromacidsulphatesolu tions[J].ElectrochimiaActa,1994,39:2353.
[7] ScharifkerB ,HillsG .Theoreticalandexperimentalstudiesofmultiplenucleation[J].Electrochim.Acta,1983,28:879.
