运用循环伏安和计时安培法研究酸性镀铜溶液中硫酸和 2_巯基苯骈咪唑对铜电沉积初期行为的影响 .实验表明铜的电沉积经历了晶核形成过程 ,其电结晶按瞬时成核三维生长方式进行 ,硫酸对铜的电沉积具有加速作用 ,而 2_巯基苯骈咪唑对铜的电沉积起阻化作用 ,两者均不改变铜的电结晶机理
Initial stages of copper electrodeposition on glassy carbon electrode from acid sulphate solutions were studied using cyclic voltammetry and chronoamperometry.The electrolyte solution was a 0.05 mol.L -1 copper sulphate,1.4~1.8 mol.L -1 sulphuric acid containing 1 mg.L -1 2_mercaptobenzoimidazole,Results show that 2_mercaptobenzoimidazole produced an inhibition of the copper deposition,probably related to the adsorption,sulphuric acid promote copper electrodeposition.The initial deposition kinetics corresponded to a model including instantaneous nucleation and diffusion controlled growth.Addition of 2_mercaptobenzoimidazole and sulphuric acid did not change the initial nucleation of copper electrocrystallization,it increased the nucleation rate and the number density of nuclei at the surface.
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