应用电化学阻抗谱(EIS)方法研究了铝青铜的腐蚀溶解机制.结果表明,在活性溶解区,铝青铜以氯化络合物的形式溶解,并且CuCl2的扩散是该溶解过程的控制步骤;而在过渡区,铝青铜的EIS谱出现第2个容抗弧,这是由于CuCl络合物和氧化腐蚀产物在电极表面沉积成膜所致;在极限电流区,腐蚀产物膜产生破损点,导致电极表面快速溶解,产生严重的点蚀,这就是在该区域极化电位下EIS出现感抗弧的原因.

The corrosion dissolution mechanism of Al-bronze has been investigated by Electrochemical Impedance Spectroscopy (EIS) at different anodic potentials. In the active region, the corrosion products are complex compounds of cupreous chloride and the diffusion of CuCl~(-)_2 is the control process of electrochemical reaction. In the transition region, there exhibits two capacitance loops on EIS because CuCl and cupreous oxides films deposit on the electrode surface. In the limiting current region, an inductance loop appears on the EIS because the breakdown of the oxides film leads to serious pit corrosion.