旋转对流下铜在微沟道中的电沉积
收稿日期: 2004-05-28
修回日期: 2004-05-28
网络出版日期: 2004-05-28
Electrodeposition of Copper into Trenches Under Rotating Hydrodynamic Condition
Received date: 2004-05-28
Revised date: 2004-05-28
Online published: 2004-05-28
孙建军 . 旋转对流下铜在微沟道中的电沉积[J]. 电化学, 2004 , 10(2) : 210 -214 . DOI: 10.61558/2993-074X.1567
/
〈 |
|
〉 |