利用电沉积技术制作微流控芯片金属模具,方法是:使用新型超厚光刻胶SU8胶作近紫外光刻,并在光刻后的图案上电沉积金属Ni,之后去胶,最终获得金属模具.该法减小了电沉积工作量.采用反向电流预处理基底、并适当增加电铸液的添加剂以及脱模后真空退火,即可明显提高电沉积微结构与基底的结合力.用此金属模具成功热压了PMMA,制成了微流控芯片.

Many researches have been focused on polymer microfluidic chip in recent years and the mould plays an important role in its fabrication process. Using electrodepositingmethod to fabricate a metal mould for polymer microfluidic chip has been presented in this paper. An ultra-thick photoresist SU-8 was coated on a pretreated metal plate, after photolithography, nickel was electrodeposited in the patterned SU-8, then was removed the SU-8 to obtain a final metal mould. This methodreduces workload of electrodeposit largely. Applying counter current before deposit, adding additive to solution and vacuum anneal after demould have been used to improve the binding force between Ni substrate and electrodeposit structure.