研究乙二胺稳定剂对化学镀N i-B合金沉积速率和镀液稳定性的影响.实验表明,少量乙二胺可改善镀液的稳定性.镀液的电化学测试发现,乙二胺对体系的阳极过程和阴极过程均有影响,还原剂的氧化电流和合金的还原电流均随乙二胺加入量的增加而减少.红外光谱显示乙二胺附在镍基体表面发生化学吸附,从而抑制了还原剂的氧化,降低N i-B化学沉积速率(稳定了镀液).

The effects of ethylenediamine stabilizer on the deposition rate and on the stability of the plating bath for electroless deposition of Ni-B alloy were investigated.It was found that the addition of ethylenediamine greatly enhances the stability of the electroless plating bath.The electrochemical polarization including cathodic and anodic polarizations measurements were carried out to examine the effect of ethylenediamine on the deposition process.The results show that ethylenediamine affects both the cathodic and the anodic polarization processes.The oxidation current of the reducer and the reduction current of Ni-B alloy decrease greatly when ethylenediamine was added into the plating bath.The infrared spectroscopy(IR) experiments were carried out to investigate the mechanism of ethylenediamine on the deposition process.It was found that ethylenediamine restrains the oxidation of the reducer owing to its chemically adsorbing on the nickel substrate,which greatly decreases the deposition rate.