欢迎访问《电化学(中英文)》期刊官方网站,今天是
研究论文

乙二胺在化学沉积Ni-B合金中的机理

  • 王森林
展开
  • 华侨大学材料科学与工程学院 福建泉州362021

收稿日期: 2005-11-28

  修回日期: 2005-11-28

  网络出版日期: 2005-11-28

The Mechanism of Ethylenediamine on Electroless Ni-B Alloy Deposition

  • WANG Sen-lin
Expand
  • (College of Materials Science and Engineering,Huaqiao University,Quanzhou 362021,China

Received date: 2005-11-28

  Revised date: 2005-11-28

  Online published: 2005-11-28

摘要

研究乙二胺稳定剂对化学镀N i-B合金沉积速率和镀液稳定性的影响.实验表明,少量乙二胺可改善镀液的稳定性.镀液的电化学测试发现,乙二胺对体系的阳极过程和阴极过程均有影响,还原剂的氧化电流和合金的还原电流均随乙二胺加入量的增加而减少.红外光谱显示乙二胺附在镍基体表面发生化学吸附,从而抑制了还原剂的氧化,降低N i-B化学沉积速率(稳定了镀液).

本文引用格式

王森林 . 乙二胺在化学沉积Ni-B合金中的机理[J]. 电化学, 2005 , 11(4) : 430 -434 . DOI: 10.61558/2993-074X.1682

Abstract

The effects of ethylenediamine stabilizer on the deposition rate and on the stability of the plating bath for electroless deposition of Ni-B alloy were investigated.It was found that the addition of ethylenediamine greatly enhances the stability of the electroless plating bath.The electrochemical polarization including cathodic and anodic polarizations measurements were carried out to examine the effect of ethylenediamine on the deposition process.The results show that ethylenediamine affects both the cathodic and the anodic polarization processes.The oxidation current of the reducer and the reduction current of Ni-B alloy decrease greatly when ethylenediamine was added into the plating bath.The infrared spectroscopy(IR) experiments were carried out to investigate the mechanism of ethylenediamine on the deposition process.It was found that ethylenediamine restrains the oxidation of the reducer owing to its chemically adsorbing on the nickel substrate,which greatly decreases the deposition rate.

参考文献

[1]Gorbunova K M,Lvanov M V,Moiseev V P.E lectrolessdeposition of n ickel-boron alloy[J]J.E lectrochem.Soc.,1973,120(5):613. [2]Zhang H Z,Zhang X J,Zhang Y K.Strucure and proper-ties of electroless n ikel-boron alloy[J].P lating&Sur-face F in ish ing,1993,April:80. [3]G iampaolo A R D i,O rdonez J G,Gugliem acc i JM,et al.E lectroless n ickel-boron coatings on m etal carb ides[J].Surface&Coatings Technology,1997,89:127. [4]Delaunois F,L ienard P.Heat treatm ents for electrolessn ickel-boron p lating on alum in ium alloys[J].Surface&Coatings Technology,2002,160:239. [5]Ohno I.E lectrochem istry of p lating[J].M aterials Soc.Eng.,1991,A146(33):33. [6]Paunovic M.E lectrochem ical aspects of electroless depo-sition ofm etal[J].P lating,1968,55:1161. [7]W u Jin-Guang(吴谨光)Ch ief-Edr.Technology andApp lication ofModern Fourier Transform Irfrared Spec-trum(近代傅立叶变换红外光谱技术及应用)[M].Be ijing(北京):L iterature of Sc ience and TechnologyPress,1994.
文章导航

/