以乙醛酸作还原剂,Na2EDTA.2H2O为络合剂,亚铁氰化钾和2,2'-联吡啶为添加剂组成化学镀铜液体系,应用线性扫描伏安法研究分析了络合剂、添加剂对该镀铜体系电化学性能的影响.结果表明,络合剂Na2EDTA对乙醛酸的氧化和铜的还原有阻碍作用.亚铁氰化钾和过量(20 mg/L)的2,2'-联吡啶对乙醛酸的氧化起较明显的抑制作用.
The electroless copper plating using glyoxylic acid as a reducing agent,Na_(2)EDTA as a chelating agent and K_(4)Fe(CN)_(6) and 2,2'-dipyridyl as additives was studied.The effect of chelating agent and addtives on the polangation behaviovs of copper reduction and glyoxylie acid oxidation were analyzed by linear sweep voltammetry.The results mainly demonstrated that the chelating agent hindered both the oxidation of glyoxylic acid and the reduction of copper complexing ions.It has revealed that K_(4)Fe(CN)_(6)and 2,2'-dipyridyl(with the content over than 20 mg/L)both played negative actions on the oxidation of glyoxylic acid.
[1]Yosi Shacham-D iam and,Sergey Lopatin.Integratedelectroless m etallization for ULSI[J].E lectroch im icaActa,1999,44:3639~3649.
[2]Garza M,L iu J.Adhesion behavior of electroless deposi-ted Cu on Pt/Ta silicate and Pt/S iO2[J].App lied Sur-face Sc ience,2004,222:253~262.
[3]Jiang X iao-X ia(姜晓霞),Shen W e i(沈伟).The fun-dam entals and practice of electroless p lating[M].Be i-jing:National Defence Industry Press,2000:13~19.
[4]Paunovic M.E lectrochem ical aspects of electroless depo-sition ofm etals[J].P lating,1968,55:1 161~1 167.
[5]Honm a H,Kobayash i T.E lectroless copper despositionpresence using glyoxylic ac id as a reduc ing agent[J].J.E lectrochem.Soc.,1994,141(3):730~733.
[6]L in Y i-M ao,Yen Sh i-Chern.E ffects of add itives andchelating agents on electroless copper p lating[J].App l.Surf.Sc i.,2001,178(3):116~126.
[7]Vas kelis A,Jus ke nas R,and Jac iausk ien J.Copperhydride form ation in the electroless copper p latingprocess:in situ x-ray d iffraction evidence and electro-chem ical study[J].E lectroch im ica.Acta,1998,43(9):1 061~1 066.
[8]B indra P,Roldan J.M echan ism of electroless m etalp lating[J].J.E lectrochem.Soc.,1985,132(11):2581.
[9]Burke L D,Ahern M J G,Ryan T G.An investigationof the anod ic behavior of copper and its anod ically pro-duced oxides in aqueous solutions of h igh pH[J].J.E lectrochem.Soc.,1990,137(2):553.
[10]Jun L i,HarleyHayden,Pau lA Kohl.The influence of2,2'-d ipyridyl on non-form aldehyde electroless cop-per p lating[J].E lectroch im ica Acta.,2004,49:1 789~1 795.
[11]Deposition rate and morphology of electroless copperfilm from solutions contain ing 2,2'-d ipyridyl[J].E lectroch im ica.Acta,1997,42(9):1 435~1 440.
[12]Nuzzi F J.Accelerating the rate of electroless copperplating[J].Plat&Surf.Finish,1983,70(1):51~54.
[13]Hung A.E ffects of th iourea guan id ine hydrochloride onelectroless copper p lating[J].J.E lectrochem.Soc.,1985,132(5):1 047~1 049.
