乙醛酸化学镀铜的电化学研究

吴丽琼; 杨防祖

doi:10.61558/2993-074X.1676

电化学 >

2005 , Vol. 11 >Issue 4: 402 - 406

DOI: https://doi.org/10.61558/2993-074X.1676

研究论文

乙醛酸化学镀铜的电化学研究

吴丽琼 ,
杨防祖

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厦门大学化学化工学院固体表面物理化学国家重点实验室,厦门大学化学化工学院固体表面物理化学国家重点实验室,厦门大学化学化工学院固体表面物理化学国家重点实验室,厦门大学化学化工学院固体表面物理化学国家重点实验室,厦门大学化学化工学院固体表面物理化学国家重点实验室福建厦门361005,福建厦门361005,福建厦门361005,福建厦门361005,福建厦门361005

收稿日期: 2005-11-28

修回日期: 2005-11-28

网络出版日期: 2005-11-28

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An Electrochemical Study of Electroless Copper Plating Using Glyoxylic Acid as Reducing Agent

WU Li-Qiong ,
YANG Fang-Zu~

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(*),HANG Ling,SUN Shi-Gang,ZHOU Shao-Min(College of Chemistry and Chemical Engineering,State Key Laboratory ofPhysical Chemistry of the Solid Surfaces,Xiamen University,Xiamen 361005,China

Received date: 2005-11-28

Revised date: 2005-11-28

Online published: 2005-11-28

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摘要

以乙醛酸作还原剂,Na2EDTA.2H2O为络合剂,亚铁氰化钾和2,2'-联吡啶为添加剂组成化学镀铜液体系,应用线性扫描伏安法研究分析了络合剂、添加剂对该镀铜体系电化学性能的影响.结果表明,络合剂Na2EDTA对乙醛酸的氧化和铜的还原有阻碍作用.亚铁氰化钾和过量(20 mg/L)的2,2'-联吡啶对乙醛酸的氧化起较明显的抑制作用.

关键词： 化学镀铜; 乙醛酸; 络合剂; 添加剂; 极化

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吴丽琼 , 杨防祖 . 乙醛酸化学镀铜的电化学研究[J]. 电化学, 2005 , 11(4) : 402 -406 . DOI: 10.61558/2993-074X.1676

Abstract

The electroless copper plating using glyoxylic acid as a reducing agent,Na_(2)EDTA as a chelating agent and K_(4)Fe(CN)_(6) and 2,2'-dipyridyl as additives was studied.The effect of chelating agent and addtives on the polangation behaviovs of copper reduction and glyoxylie acid oxidation were analyzed by linear sweep voltammetry.The results mainly demonstrated that the chelating agent hindered both the oxidation of glyoxylic acid and the reduction of copper complexing ions.It has revealed that K_(4)Fe(CN)_(6)and 2,2'-dipyridyl(with the content over than 20 mg/L)both played negative actions on the oxidation of glyoxylic acid.

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